ZHCSAY5D march   2013  – april 2021 UCD3138064

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Options
    1. 6.1 Device Comparison Table
    2. 6.2 Product Selection Matrix
  7. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Pin Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings #GUID-DB56AA00-A5E9-4426-9853-ACC9CCD10656/SLUSB727999
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Timing Characteristics
    7. 8.7  PMBus/SMBus/I2C Timing
    8. 8.8  Power On Reset (POR) / Brown Out Reset (BOR)
    9. 8.9  Typical Clock Gating Power Savings
    10. 8.10 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 ARM Processor
      2. 9.1.2 Memory
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  System Module
        1. 9.3.1.1 Address Decoder (DEC)
        2. 9.3.1.2 Memory Management Controller (MMC)
        3. 9.3.1.3 System Management (SYS)
        4. 9.3.1.4 Central Interrupt Module (CIM)
      2. 9.3.2  Peripherals
        1. 9.3.2.1 Digital Power Peripherals
          1. 9.3.2.1.1 Front End
          2. 9.3.2.1.2 DPWM Module
          3. 9.3.2.1.3 DPWM Events
          4. 9.3.2.1.4 High Resolution DPWM
          5. 9.3.2.1.5 Over Sampling
          6. 9.3.2.1.6 DPWM Interrupt Generation
          7. 9.3.2.1.7 DPWM Interrupt Scaling/Range
      3. 9.3.3  Automatic Mode Switching
        1. 9.3.3.1 Phase Shifted Full Bridge Example
        2. 9.3.3.2 LLC Example
        3. 9.3.3.3 Mechanism For Automatic Mode Switching
      4. 9.3.4  DPWMC, Edge Generation, Intramux
      5. 9.3.5  Filter
        1. 9.3.5.1 Loop Multiplexer
        2. 9.3.5.2 Fault Multiplexer
      6. 9.3.6  Communication Ports
        1. 9.3.6.1 SCI (UART) Serial Communication Interface
        2. 9.3.6.2 PMBUS/I2C
        3. 9.3.6.3 SPI
      7. 9.3.7  Real Time Clock
      8. 9.3.8  Timers
        1. 9.3.8.1 24-Bit Timer
        2. 9.3.8.2 16-Bit PWM Timers
        3. 9.3.8.3 Watchdog Timer
      9. 9.3.9  General Purpose ADC12
      10. 9.3.10 Miscellaneous Analog
      11. 9.3.11 Brownout
      12. 9.3.12 Global I/O
      13. 9.3.13 Temperature Sensor Control
      14. 9.3.14 I/O Mux Control
      15. 9.3.15 Current Sharing Control
      16. 9.3.16 Temperature Reference
    4. 9.4 Device Functional Modes
      1. 9.4.1 DPWM Modes Of Operation
        1. 9.4.1.1 Normal Mode
        2. 9.4.1.2 Phase Shifting
        3. 9.4.1.3 DPWM Multiple Output Mode
        4. 9.4.1.4 DPWM Resonant Mode
      2. 9.4.2 Triangular Mode
      3. 9.4.3 Leading Edge Mode
    5. 9.5 Memory
      1. 9.5.1 Register Maps
        1. 9.5.1.1 CPU Memory Map and Interrupts
          1. 9.5.1.1.1 Memory Map (After Reset Operation)
          2. 9.5.1.1.2 Memory Map (Normal Operation)
          3. 9.5.1.1.3 Memory Map (System and Peripherals Blocks)
        2. 9.5.1.2 Boot ROM
        3. 9.5.1.3 Customer Boot Program
        4. 9.5.1.4 Flash Management
        5. 9.5.1.5 Synchronous Rectifier MOSFET Ramp and IDE Calculation
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 PCMC (Peak Current Mode Control) PSFB (Phase Shifted Full Bridge) Hardware Configuration Overview
        2. 10.2.2.2 DPWM Initialization for PSFB
          1. 10.2.2.2.1 DPWM Synchronization
        3. 10.2.2.3 Fixed Signals to Bridge
        4. 10.2.2.4 Dynamic Signals to Bridge
        5. 10.2.2.5 System Initialization for PCM
          1. 10.2.2.5.1 Use of Front Ends and Filters in PSFB
          2. 10.2.2.5.2 Peak Current Detection
          3. 10.2.2.5.3 Peak Current Mode (PCM)
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Introduction To Power Supply and Layout Recommendations
    2. 11.2 3.3-V Supply Pins
    3. 11.3 Recommendation for V33 Ramp up Slew Rate for UCD3138 and UCD3138064
    4. 11.4 Recommendation for RC Time Constant of RESET Pin for UCD3138 and UCD3138064
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 EMI and EMC Mitigation Guidelines
      2. 12.1.2 BP18 Pin
      3. 12.1.3 Additional Bias Guidelines
      4.      UCD3138 Pin Connection Recommendation
        1. 12.1.4.1 Current Amplifier With EADC Connection
        2. 12.1.4.2 DPWM Synchronization
        3. 12.1.4.3 External Clock
        4. 12.1.4.4 GPIOS
        5. 12.1.4.5 DPWM PINS
        6. 12.1.4.6 EAP and EAN Pins
        7. 12.1.4.7 ADC Pins
          1. 12.1.4.7.1 RESET Pin
      5. 12.1.4 UART Communication Port
      6.      Special Considerations
    2. 12.2 Layout Example
      1. 12.2.1 UCD3138 and UCD3138064 40 Pin
      2. 12.2.2 UCD3138 and UCD3138064 64 Pin
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Trademarks
    4. 13.4 静电放电警告
    5. 13.5 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Revision History

Changes from Revision C (March 2017) to Revision D (April 2021)

  • 通篇添加了 40 引脚 RJA 封装选项；更改了同步功能说明，以指明它适用于所有 UCD3138 系列成员，而不仅仅是 UCD3138064；将“器件概述”部分拆分为 4 个部分，以符合 TI 数据表标准Go
  • 向“器件信息”表中添加了 RJA 封装将 ADC 通道数从 14 更改为 15，因为通道 0 至 13 用于外部引脚，通道 14 用于内部温度传感器Go
  • 为新设计注释添加了 RJA 封装Go
  • Added RJA to top line, deleted empty column, deleted row with External Crystal Clock Support, since only UCD3138128A supports it Go
  • Add RJA Package top view, as well as notes about corner pad soldering and reliability for both RMH and RJA packages.Go
  • Add DAC Output as an alternate pin assignment for pins 2, 3, and 4 on the 40 pin QFN package table. Change package descriptions in tables for clarity and consistencyGo
  • Add reference to IC Package Thermal Metrics application report in thermal table Go
  • Add RJA package to thermal table Go
  • Fixed cross reference for current share resistor and current source Go
  • Rise and fall time descriptions were switched to make them match the data. Before the rise time spec was in the row for fall times and vice versa. They were labeled correctly, so the error was obviousGo
  • Add "Using Front End EADCs" to the bullet describing the digital comparatorsGo
  • Remove pin numbers from table, as they were unnecessary and only applied to 64 pin package. Add note that Global I/O settings travel with the pin and don't move when the IOMUX register moves the pin function to another pin. Go
  • Changed temperature sensor ADC channel from 15 to 14 Go
  • Replaced the Device Grounding and Layout Guidelines sub -section with the Power Supply Recommendations Section and Layout Section. The new content is copied directly from the UCD3138 Family Practical Design Guideline Application Note. Go
  • Update links and references to latest tool and document set Go

Changes from Revision B (September 2014) to Revision C (March 2017)

  • Changed Device Grounding and Layout Guidelines section Go

Changes from Revision A (February 2014) to Revision B (July 2014)

  • 添加了引脚配置和功能 部分、处理等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • 通篇添加了 40 引脚 RMH QFN 封装选项Go

Changes from Revision * (March 2013) to Revision A (February 2014)

  • Deleted table: Summary Of Key Differences Between UCD3138x & UCD3138Go
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