SFFS258 August 2021 TPSM560R6
1 Overview
This document contains information for TPSM560R6 (B3QFN package) to aid in a functional safety system design. Information provided are:
- Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
- Component failure modes and their distribution (FMD) based on the primary function of the device
- Pin failure mode analysis (Pin FMA)
Figure 1-1 shows the device functional block diagram for reference.
Figure 1-1 Functional Block
DiagramTPSM560R6 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.