SFFS693 September 2023 UCC21551-Q1
The failure mode distribution estimation for the UCC21551-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.
| Die Failure Modes | Failure Mode Distribution (%) |
|---|---|
| OUTA stuck low | 15% |
| OUTB stuck low | 15% |
| OUTA and OUTB stuck low | 2% |
| OUTA stuck high | 10% |
| OUTB stuck high | 10% |
| DT out of specified range | 3% |
| OUTA unknown or not in specified range | 9% |
| OUTB unknown or not in specified range | 9% |
| OUTA or OUTB stuck low | 1% |
| OUTA or OUTB stuck high | 1% |
| OUTA and/or OUTB unknown or not in specified range | 15% |
| No effect or distribution less than 1% | 10% |
The FMD in Table 3-1 excludes short-circuit faults across the isolation barrier. Faults for short circuits across the isolation barrier can be excluded according to ISO 61800-5-2:2016 if the following requirements are fulfilled:
Apply creepage and clearance requirements according to the specific equipment isolation standards of an application. Care must be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance.