over operating free-air temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
| VCC |
Supply voltage(3) |
At DVCC and AVCC pins |
–0.3 |
4.1 |
V |
| At DVCC, AVCC, and PVCC pins |
–0.3 |
4.1 |
|
Voltage difference between DVCC and AVCC
pins(2) |
|
±0.3 |
V |
|
Voltage difference among DVCC, AVCC, and PVCC
pins(2) |
|
±0.3 |
V |
| VI |
Input voltage(3) |
Applied to CHx_IN |
–0.3 |
1.65 |
V |
| Applied to CHx_IN with a duty cycle of 10% over 1 ms |
–0.3 |
1.8 |
| Applied to USSXTIN (USSXTOUT) |
–0.3 |
1.5 |
| Applied to any other pin |
–0.3 |
VCC + 0.3 V
(4.1 V
Max) |
|
Diode current at any device pin |
|
±2 |
mA |
| Tstg |
Storage temperature (4) |
–40 |
125 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) Voltage differences between DVCC and AVCC that exceed the specified limits can cause malfunction of the device including
erroneous writes to RAM and FRAM.
(3) Voltages are referenced to VSS.
(4) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with
peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.