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SLUAA61B September 2022 – November 2022 UCC27282-Q1 , UCC27284-Q1

1.2.1 SOIC Package

This section provides Functional Safety Failure In Time (FIT) rates for the SOIC package of UCC27282-Q1 UCC27284-Q1 based on two different industry-wide used reliability standards:

Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11

Table 1-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours)
Total Component FIT Rate (Power dissipation:10 mW, 100 mW, 500 mW)	13,14,28
Die FIT Rate (Power dissipation: 10 mW, 100 mW, 500 mW)	2,3,14
Package FIT Rate (Power dissipation:10 mW,100mW, 500mW)	11,11,14

The failure rate and mission profile information in Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission Profile: Motor Control from Table 11
Power dissipation: 10 mW, 100 mW, 500 mW
Climate type: World-wide Table 8
Package factor (lambda 3): Table 17b
Substrate Material: FR4
EOS FIT rate assumed: 0 FIT

Table 1-2 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	CMOS, BICMOS, Digital, analog /mixed	20 FIT	55°C