ZHCSF55E June 2016 – December 2021 UCC21520
PRODUCTION DATA
Figure 12-1 shows a 2-layer PCB layout example with the signals and key components labeled.
Figure 12-2 and Figure 12-3 shows top and bottom layer traces and copper.
There are no PCB traces or copper between the primary and secondary side, which ensures isolation performance.
PCB traces between the high-side and low-side gate drivers in the output stage are increased to maximize the creepage distance for high-voltage operation, which will also minimize cross-talk between the switching node VSSA (SW), where high dv/dt may exist, and the low-side gate drive due to the parasitic capacitance coupling.
Figure 12-4 and Figure 12-5 are 3D layout pictures with top view and bottom views.
The location of the PCB cutout between the primary side and secondary sides, which ensures isolation performance.