ZHCSGS7J september   2017  – august 2023 TPS7B82-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Grade 1 Options
    6. 6.6 Electrical Characteristics: Grade 0 Options
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Enable (EN)
      2. 7.3.2 Undervoltage Shutdown
      3. 7.3.3 Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN Lower Than 3 V
      2. 7.4.2 Operation With VIN Larger Than 3 V
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS7B82-Q1 UNIT
DGN
(HVSSOP)		 DRV
(WSON)		 KVU
(TO-252)		 PWP
(HTSSOP)
8 PINS 6 PINS 5 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 63.9 72.8 31.1 52.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.2 85.8 39.9 48.2 °C/W
RθJB Junction-to-board thermal resistance 22.6 37.4 9.9 28.2 °C/W
ψJT Junction-to-top characterization parameter 1.8 2.7 4.2 2.5 °C/W
ψJB Junction-to-board characterization parameter 22.3 37.3 9.9 28.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.1 13.8 2.8 10.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
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