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ZHCSIL2C July 2018 – March 2022 UCC24624

PRODUCTION DATA

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		DEVICE	UNIT
		D (SOIC)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	108.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	43.5	°C/W
R_θJB	Junction-to-board thermal resistance	53.6	°C/W
Ψ_JT	Junction-to-top characterization parameter	4.9	°C/W
Ψ_JB	Junction-to-board characterization parameter	52.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.