ZHCSJZ2D August   2019  – April 2021 THS6222

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 12 V
    6. 6.6 Electrical Characteristics: VS = 32 V
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics: VS = 12 V
    9. 6.9 Typical Characteristics: VS = 32 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Common-Mode Buffer
      2. 7.3.2 Thermal Protection and Package Power Dissipation
      3. 7.3.3 Output Voltage and Current Drive
      4. 7.3.4 Breakdown Supply Voltage
      5. 7.3.5 Surge Test Results
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Broadband PLC Line Driving
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 What to Do and What Not to Do
      1. 8.3.1 Do
      2. 8.3.2 Do Not
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Wafer and Die Information
    3. 10.3 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

4 Revision History

Changes from Revision C (November 2020) to Revision D (April 2021)

  • Corrected the wrong pin diagram image that was tagged incorrectly during system migrationGo

Changes from Revision B (April 2020) to Revision C (November 2020)

  • 更新了整个文档的表、图和交叉参考的编号格式Go
  • 向器件信息 表中添加了 VQFN (16) 封装Go
  • Updated the RHF package in the Pin Configuration and Functions sectionGo
  • Added the RGT package in the Pin Configuration and Functions sectionGo

Changes from Revision A (December 2019) to Revision B (April 2020)

  • 向器件信息表添加了晶圆销售封装和封装尺寸（标称值）Go
  • Added the YS Die bondpad and functionsGo
  • Updated Table 1 BIAS-1 and BIAS-2 Logic TableGo
  • Added Wafer and Die Information sectionGo

Changes from Revision * (August 2019) to Revision A (December 2019)

  • 将器件状态从“预告信息”更改为“量产数据”Go
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