ZHCSK77E September   2009  – July 2024 TS3USB221E

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Dynamic Electrical Characteristics, VCC = 3.3 V ±10%
    7. 5.7  Dynamic Electrical Characteristics, VCC = 2.5 V ±10%
    8. 5.8  Switching Characteristics, VCC = 3.3 V ±10%
    9. 5.9  Switching Characteristics, VCC = 2.5 V ±10%
    10. 5.10 Typical Characteristics
  7.   Parameter Measurement Information
  8. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Low Power Mode
    4. 6.4 Device Functional Modes
  9. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  11. Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision D (September 2019) to Revision E (July 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Changed ESD HBM performance testing standard from: JESD 22 to: JEDEC JS-001Go
  • Changed ESD CDM performance testing standard from: JESD22-C101 to: JEDEC JS-002Go
  • Added tablenote to the Data input/output voltage parameterGo
  • Changed RSE (UQFN) junction-to-ambient thermal resistance value from: 169.8°C/W to: 204.8°C/WGo
  • Changed RSE (UQFN) junction-to-case (top) thermal resistance value from: 84.7°C/W to: 118.1°C/WGo
  • Changed RSE (UQFN) junction-to-board thermal resistance value from: 94.9°C/W to: 121.5°C/WGo
  • Changed RSE (UQFN) junction-to-top characterization parameter value from: 5.7°C/W to: 13.9°C/WGo
  • Changed RSE (UQFN) junction-to-board characterization parameter value from: 94.9°C/W to: 121.2°C/WGo
  • Changed the VIK value in the Electrical Characteristics table from: –1.8V maximum to: –1.8V minimumGo
  • Changed the graphs in the Typical Characteristics sectionGo

Changes from Revision C (April 2015) to Revision D (September 2019)

  • 将 VCC 工作范围从 2.5V 至 3.3V 更改为 2.3V 至 3.6VGo

Changes from Revision B (July 2012) to Revision C (April 2015)

  • 添加了引脚配置和功能 部分、ESD 等级 表、热性能信息 表、特性说明 部分、器件功能模式应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • 删除了订购信息Go

Changes from Revision A (February 2010) to Revision B (July 2012)

  • 更新了订购信息 表中 RSE 封装的顶部标记Go