Features are integrated in the ISO164x to help protect the device from high current events. Enhanced ESD protection cells are designed on the I2C bus pins to support 10 kV HBM ESD on side 1 and 14 kV HBM ESD on side 2. The I2C bus pins on side 2 are designed to withstand an unpowered IEC ESD strike of 8kV, improving robustness and system reliability in hot swap applications. In addition to the improved ESD performance, a short circuit protection circuit is included on side 2 to protect the bus pins (SDA2 and SCL2) against strong short circuits of 5 ohms or less to VCC2.

Thermal shutdown is integrated in the ISO164x to protect the device from high current events. If the junction temperature of the device exceeds the thermal shutdown threshold of 190C (typical), the device turns off, disabling the I2C circuits and releasing the bus. The shutdown condition is cleared when the junction temperature drops at least the thermal shutdown hysteresis temperature of 10C (typical) below the thermal shutdown temperature of the device.