SN74ABTH245
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- Latch-Up Performance Exceeds 500 mA Per JESD 17
- Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
- Ioff and Power-Up 3-State Support Hot Insertion
- High-Drive Outputs (-32-mA IOH, 64-mA IOL)
- Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
- Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Thin Very Small-Outline (DGV) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package
EPIC-IIB is a trademark of Texas Instruments Incorporated.
These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE\) input can be used to disable the device so the buses are effectively isolated.
When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN54ABTH245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABTH245 is characterized for operation from -40°C to 85°C.
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14-24-LOGIC-EVM 评估模块 (EVM) 旨在支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
PDIP (N) | 20 | Ultra Librarian |
SOIC (DW) | 20 | Ultra Librarian |
SSOP (DB) | 20 | Ultra Librarian |
TSSOP (PW) | 20 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点