THS4521
- Fully Differential Architecture
- Bandwidth: 145 MHz (AV = 1 V/V)
- Slew Rate: 490 V/µs
- HD2: –133 dBc at 10 kHz (1 VRMS,
RL = 1 kΩ) - HD3: –141 dBc at 10 kHz (1 VRMS,
RL = 1 kΩ) - Input Voltage Noise: 4.6 nV/√Hz
(f = 100 kHz) - THD+N: –112dBc (0.00025%) at
1 kHz (22-kHz BW, G = 1, 5 VPP) - Open-Loop Gain: 119 dB (DC)
- NRI–Negative Rail Input
- RRO–Rail-to-Rail Output
- Output Common-Mode Control
(with Low Offset) - Power Supply:
- Voltage: +2.5 V (±1.25 V) to
+5.5 V (±2.75 V) - Current: 1.14 mA/ch
- Voltage: +2.5 V (±1.25 V) to
- Power-Down Capability: 20 µA (typical)
The THS4521, THS4522, and THS4524 family of devices are very low-power, fully differential amplifiers with rail-to-rail output and an input common-mode range that includes the negative rail. These amplifiers are designed for low-power data acquisition systems and high-density applications where power dissipation is a critical parameter, and provide exceptional performance in audio applications.
The family includes single FDA (THS4521), dual FDA (THS4522), and quad FDA (THS4524) versions.
These fully differential amplifiers feature accurate output common-mode control that allows for dc-coupling when driving analog-to-digital converters (ADCs). This control, coupled with an input common-mode range below the negative rail as well as rail-to-rail output, allows for easy interfacing between single-ended, ground-referenced signal sources. Additionally, these devices are ideally suited for driving both successive-approximation register (SAR) and delta-sigma (ΔΣ) ADCs using only a single +2.5V to +5V and ground power supply.
The THS4521, THS4522, and THS4524 family of fully differential amplifiers is characterized for operation over the full industrial temperature range from –40°C to +85°C.
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设计和开发
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THS4521EVM 用户指南包含在米6体育平台手机版_好二三四数据表中。
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点