TS3V340
- Low Differential Gain and Phase (DG = 0.2%, DP = 0.1° Typ)
- Wide Bandwidth (BW = 500 MHz Typ)
- Low Crosstalk (XTALK = –80 dB Typ)
- Bidirectional Data Flow, With Near-Zero Propagation Delay
- Low and Flat ON-State Resistance (ron = 3 Typ)
- VCC Operating Range From 3 V to 3.6 V
- Ioff Supports Partial-Power-Down Mode Operation
- Data and Control Inputs Provide Undershoot Clamp Diode
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
- Suitable for Both RGB and Composite Video Switching
The TI video switch TS3V340 is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN)\ input. When EN\ is low, the switch is enabled and the D port is connected to the S port. When EN\ is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.
Low differential gain and phase makes this switch ideal for composite and RGB video applications. The device has a wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.
To ensure the high-impedance state during power up or power down, EN\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TS3V340 数据表 (Rev. A) | 2004年 12月 2日 | |||
应用手册 | 防止模拟开关的额外功耗 | 英语版 | 2008年 7月 15日 | |||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
设计和开发
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EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。
LEADLESS-ADAPTER1 — 用于测试 TI 6、8、10、12、14、16 和 20 引脚无引线封装的表面贴装转 DIP 接头适配器
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
SSOP (DBQ) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
TVSOP (DGV) | 16 | Ultra Librarian |
VQFN (RGY) | 16 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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