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Octavo Systems
System-in-package vendor for TI Arm-based processors with in-house manufacturing
To improve the capability and value of our customers’ electronic systems by delivering innovative, high-quality system-in-package solutions, Octavo Systems brings new technologies and new integration paths to innovative companies around the globe.
By creating SiP devices, Octavo allows the idea behind Moore’s law to continue as the industry transitions from system on chip (SoC) as the system integration method to system in package (SiP) technology as the solution of choice. Through Octavo's technology and design innovations, this technology is more accessible to all, allowing for the continued development of smaller, more cost effective and more innovative products.
基于 Arm 的处理器
联系人
-
+1-512-861-3400
- 联系合作伙伴
- octavosystems.com
提供的资源
- 评估板
支持的地区
- 中国
- 亚洲其他地区
- 北美
- 南美洲
- 印度
- 大洋洲
- 日本
- 欧洲
- 非洲
公司总部
- 2277 Plaza Drive Suite 610
- Sugar Land, TX 77479
- Austin, Texas, 78701
- United States
资源
评估板
OCTVO-3P-AM335X — Octavo Systems 基于 AM335x 的系统级封装
Octavo Systems 是向全球创新者提供基于系统级封装 (SiP) 解决方案的领导者。通过 OSD335x 系列 SiP 器件，能以最快且最具成本效益的方法来开发和部署基于米6体育平台手机版_好二三四 (TI) Sitara™ AM335x Arm® Cortex®-A8 处理器的高性能嵌入式系统。
OSD335x 器件可将 Sitara™ AM335x Arm® Cortex®-A8 处理器（运行频率高达 1GHz 且 DDR3高达 1GB）、TPS65217C 电源管理 IC、TL5209 LDO、EEPROM（可选）、eMMC（可选）、MEMS (...)
评估板
OCTVO-3P-OSD62X — Octavo Systems OSD62x system-in-package for AM623 and AM625 Arm® Cortex®-A53 1.4-GHz processors
The OSD62x SiP technology allows designers to build a smaller generation of a variety of products in the same applications where the AM62x device is commonly used, including: building automation, factory automation and control, IoT gateway, edgeAI, and HMI. The SiP integrates the low-power, (...)