Product details

Package name SOD323 (SOT) Peak pulse power (8/20 μs) (max) (W) 159 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 3 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (A) 3.5 Features ESD Protection Clamping voltage (V) 40 Dynamic resistance (typ) 0.45 Interface type LIN Breakdown voltage (min) (V) 25.5 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -50 to 150
Package name SOD323 (SOT) Peak pulse power (8/20 μs) (max) (W) 159 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 3 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (A) 3.5 Features ESD Protection Clamping voltage (V) 40 Dynamic resistance (typ) 0.45 Interface type LIN Breakdown voltage (min) (V) 25.5 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -50 to 150
SOT (DYF) 2 3.445 mm² 2.65 x 1.3
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30-kV contact discharge
    • ±30-kV air-gap discharge
  • Robust surge protection:

    • IEC 61000-4-5 (8/20 µs): 4.3 A

  • 24-V working voltage
  • Bidirectional ESD protection
  • Low clamping voltage protects downstream components
  • Temperature range: –55°C to +150°C
  • I/O capacitance = 2.3 pF (typical)
  • Offered in industry standard package: SOD-323 (DYF)
  • Leaded packages used for automatic optical inspection (AOI)
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30-kV contact discharge
    • ±30-kV air-gap discharge
  • Robust surge protection:

    • IEC 61000-4-5 (8/20 µs): 4.3 A

  • 24-V working voltage
  • Bidirectional ESD protection
  • Low clamping voltage protects downstream components
  • Temperature range: –55°C to +150°C
  • I/O capacitance = 2.3 pF (typical)
  • Offered in industry standard package: SOD-323 (DYF)
  • Leaded packages used for automatic optical inspection (AOI)

The ESD1LIN24 is a single-channel low capacitance bidirectional ESD protection device for local interconnect network (LIN). This device is rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±30-kV Contact, ±30-kV Airgap). The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key in safety systems that require a high level of robustness and reliability.

The ESD1LIN24 is a single-channel low capacitance bidirectional ESD protection device for local interconnect network (LIN). This device is rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±30-kV Contact, ±30-kV Airgap). The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key in safety systems that require a high level of robustness and reliability.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
ESD1LIN24-Q1 ACTIVE Automotive, 2.3-pF, ±24-V, ±30-kV ESD protection diode for LIN interfaces in SOD-32 Automotive ±24-V, ±30-kV ESD protection device for in-vehicle network
ESD751 ACTIVE 1.6-pF ±24-V ±22-kV ESD protection diode for USB power delivery ±24-V, ±22-kV ESD protection diode with lower line capacitance
ESD761 ACTIVE 1.1-pF ±24-V ±15-kV ESD protection diode for USB power delivery ±24-V, ±15-kV ESD protection diode with lower line capacitance

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 2
Type Title Date
* Data sheet ESD1LIN24 24-V, 1-Channel ESD Protection Diode datasheet (Rev. A) PDF | HTML 15 Dec 2022
Product overview Creating Protection for LIN Expansion Bus PDF | HTML 31 May 2023

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — ESD evaluation module

The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
User guide: PDF | HTML
Not available on TI.com
Package Pins CAD symbols, footprints & 3D models
SOT (DYF) 2 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos