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SN74AUC1G74

ACTIVE

Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset

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Data sheet

SN74AUC1G74

ACTIVE
Data sheet Order now

Product details

Number of channels 1 Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 275 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 1 Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 275 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 SSOP (DCT) 8 11.8 mm² 2.95 x 4 UQFN (RSE) 8 2.25 mm² 1.5 x 1.5 VSSOP (DCU) 8 6.2 mm² 2 x 3.1
  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 1.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments
  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 1.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments

This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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Technical documentation

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Type Title Date
* Data sheet SN74AUC1G74 datasheet (Rev. D) 25 Jun 2007
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dec 2022
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices 21 Mar 2003
User guide AUC Data Book, January 2003 (Rev. A) 01 Jan 2003
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
More literature AUC Product Brochure (Rev. A) 18 Mar 2002

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Simulation model

HSPICE MODEL OF SN74AUC1G74

SCEJ201.ZIP (94 KB) - HSpice Model
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Simulation model

SN74AUC1G74 IBIS Model (Rev. A)

SCEM396A.ZIP (54 KB) - IBIS Model
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Package Pins CAD symbols, footprints & 3D models
DSBGA (YZP) 8 Ultra Librarian
SSOP (DCT) 8 Ultra Librarian
UQFN (RSE) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

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