SN74LVC8T245

ACTIVE

8-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and Three-State Outputs

SN74LVC8T245

ACTIVE

Product details

Technology family LVC Applications GPIO Bits (#) 8 High input voltage (min) (V) 1.08 High input voltage (max) (V) 5.5 Vout (min) (V) 1.65 Vout (max) (V) 5.5 Data rate (max) (Mbps) 200 IOH (max) (mA) -32 IOL (max) (mA) 32 Supply current (max) (µA) 25 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type 3-State, Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
Technology family LVC Applications GPIO Bits (#) 8 High input voltage (min) (V) 1.08 High input voltage (max) (V) 5.5 Vout (min) (V) 1.65 Vout (max) (V) 5.5 Data rate (max) (Mbps) 200 IOH (max) (mA) -32 IOL (max) (mA) 32 Supply current (max) (µA) 25 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type 3-State, Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (DW) 24 159.65 mm² 15.5 x 10.3 SOP (NS) 24 117 mm² 15 x 7.8 SSOP (DB) 24 63.96 mm² 8.2 x 7.8 SSOP (DBQ) 24 51.9 mm² 8.65 x 6 TSSOP (PW) 24 49.92 mm² 7.8 x 6.4 TVSOP (DGV) 24 32 mm² 5 x 6.4 VQFN (RHL) 24 19.25 mm² 5.5 x 3.5
  • Control inputs V IH/V IL levels are referenced to V CCA voltage
  • V CC isolation feature – if either V CC input is at GND, all are in the high-impedance state
  • Fully configurable dual-rail design allows each port to operate over the full 1.65-V to 5.5-V power-supply range
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 4000-V Human-Body Model (A114-A)
    • 100-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Control inputs V IH/V IL levels are referenced to V CCA voltage
  • V CC isolation feature – if either V CC input is at GND, all are in the high-impedance state
  • Fully configurable dual-rail design allows each port to operate over the full 1.65-V to 5.5-V power-supply range
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 4000-V Human-Body Model (A114-A)
    • 100-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

The SN74LVC8T245 is an eight bit non-inverting bus transceiver with configurable dual power supply rails that enables bidirectional voltage level translation. The SN74LVC8T245 is optimized to operate with V CCA and V CCB set at 1.65 V to 5.5 V. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.65 V to 5.5 V. The B port is designed to track V CCB. V CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5.5-V voltage nodes.

The SN74LVC8T245 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input and the output-enable ( OE) input activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode. The device transmits data from the A bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level applied to prevent excess I CC and I CCZ.

This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The V CC isolation feature ensures that if either V CC input is at GND, all outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVC8T245 is designed so that the control pins (DIR and OE) are supplied by V CCA.

The SN74LVC8T245 is an eight bit non-inverting bus transceiver with configurable dual power supply rails that enables bidirectional voltage level translation. The SN74LVC8T245 is optimized to operate with V CCA and V CCB set at 1.65 V to 5.5 V. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.65 V to 5.5 V. The B port is designed to track V CCB. V CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5.5-V voltage nodes.

The SN74LVC8T245 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input and the output-enable ( OE) input activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode. The device transmits data from the A bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level applied to prevent excess I CC and I CCZ.

This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The V CC isolation feature ensures that if either V CC input is at GND, all outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVC8T245 is designed so that the control pins (DIR and OE) are supplied by V CCA.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 33
Type Title Date
* Data sheet SN74LVC8T245 8-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation and 3-State Outputs datasheet (Rev. C) PDF | HTML 15 Dec 2022
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12 Jul 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 Jul 2024
EVM User's guide TXV010xEVM Evaluation Module User's Guide PDF | HTML 05 Feb 2024
EVM User's guide Generic AVC and LVC Direction Controlled Translation EVM (Rev. B) 30 Jul 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
Application note Designing with SN74LVCXT245 and SN74LVCHXT245 Family of Direction Controlled 27 Oct 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Evaluation board

14-24-NL-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin non-leaded packages

14-24-NL-LOGIC-EVM is a flexible evaluation module (EVM) designed to support any logic or translation device that has a 14-pin to 24-pin BQA, BQB, RGY, RSV, RJW or RHL package.

User guide: PDF | HTML
Not available on TI.com
Evaluation board

AVCLVCDIRCNTRL-EVM — Generic EVM for Direction-Controlled Bidirectional Translation Device Supporting AVC and LVC

The generic EVM is designed to support one, two, four and eight channel LVC and AVC direction-controlled translation devices. It also supports the bus hold and automotive -Q1 devices in the same number of channels. The AVC are low voltage translation devices with lower drive strength of 12mA. LVC (...)

User guide: PDF
Not available on TI.com
Evaluation board

TXV0106-EVM — TXV0106 evaluation module

The TXV0106 evaluation module (EVM) is an easy-to-use platform to evaluate the functionality and performance of the TXV0106 device. The EVM has optional circuits and jumpers to configure the device for different applications. The device offers options for both fixed and direction control low-skew, (...)
User guide: PDF | HTML
Not available on TI.com
Evaluation board

TXV0108-EVM — TXV0108 evaluation module

The TXV0108 evaluation module (EVM) is an easy-to-use platform to evaluate the functionality and performance of the TXV0108 device. The EVM has optional circuits and jumpers to configure the device for different applications. The device offers options for both fixed and direction control low-skew, (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

SN74LVC8T245 IBIS Model

SCEM494.ZIP (56 KB) - IBIS Model
Reference designs

TIDEP0025 — Single Chip Drive for Industrial Communications and Motor Control

This reference design implements hardware interface based on the HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The platform also allows you to implement real-time EtherCAT communications standards in a broad range of industrial automation equipment. It enables designs with a low (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP0022 — ARM MPU with Integrated BiSS C Master Interface Reference Design

Implementation of BiSS C Master protocol on Industrial Communication Sub-System (PRU-ICSS). The design provides full documentation and source code for Programmable Realtime Unit (PRU).
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP0035 — ARM MPU with Integrated HIPERFACE DSL Master Interface Reference Design

This reference design implements HIPERFACE DSL master protocol on Industrial Communication Sub-System (PRU-ICSS). The two-wire interface allows integration of position feedback wires into motor cable.  It consists of AM437x PRU-ICSS firmware and TIDA-00177 transceiver reference design.
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP0050 — EnDat 2.2 System Reference Design

This reference design implements EnDat 2.2 Master protocol stack and hardware interface based on HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The design is composed of EnDat 2.2 Master protocol stack, half-duplex communications using RS-485 transceivers and the line termination (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP0057 — Multi-Protocol Digital Position Encoder Master Interface Reference Design With AM437x on PRU-ICSS

This is a reference design for industrial communication on Sitara™ processors with programmable real-time unit and industrial communication subsystem (PRU-ICSS). This design describes the integrated multi-protocol digital position encoder master interface support. The supported digital (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP0046 — Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design

TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP0047 — Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design

This is a reference design based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC).  This design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and TPS659037.  It includes (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
SOIC (DW) 24 Ultra Librarian
SOP (NS) 24 Ultra Librarian
SSOP (DB) 24 Ultra Librarian
SSOP (DBQ) 24 Ultra Librarian
TSSOP (PW) 24 Ultra Librarian
TVSOP (DGV) 24 Ultra Librarian
VQFN (RHL) 24 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos