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The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | Family of 600uA/Ch 2.8MHz Rail-to-Rail I/O High-Drive Op Amps with Shutdown datasheet (Rev. E) | 03 Jul 2007 | |
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 28 Mar 2017 | ||
| Application note | Thermistor Temperature Transducer to ADC Application | 22 Sep 2000 | ||
| Application note | Use of Rail-to-Rail Operational Amplifiers (Rev. A) | 22 Dec 1999 |
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The amplifier performance development kit (PDK) is an evaluation module (EVM) kit to test common operational amplifier (op amp) parameters and is compatible with most op amps and comparators. The EVM kit offers a main board with several socketed daughtercard options to fit package needs, allowing (...)
Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)
The DUAL-DIYAMP-EVM is an evaluation module (EVM) family that provides engineers and do it yourselfers (DIYers) with real-world amplifier circuits, enabling quick evaluation of design concepts and verify simulations. It is designed specifically for dual package op amps in the (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| HVSSOP (DGN) | 8 | Ultra Librarian |
| PDIP (P) | 8 | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |
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