TMP101-Q1
Automotive grade, ±2°C digital temperature sensor with I2C/SMBus interface and alert
TMP101-Q1
- AEC-Q100 qualified with the following results:
- Temperature grade 1: −55°C to +125°C operating temperature range
- HBM ESD component classification level 2
- CDM ESD component classification level C5
- Functional Safety-Capable
- Digital output: SMBus™, two-wire, and I2C interface compatibility
- Resolution: 9 to 12 bits, user-selectable
- Accuracy:
- ±1°C (typical) from –55°C to 125°C
- ±2°C (maximum) from –55°C to 125°C
- Low quiescent current: 45-µA, 0.1-µA standby
- Wide supply range: 2.7 V to 5.5 V
- TMP100-Q1 features two address pins
- TMP101-Q1 features one address pin and an ALERT pin
- 6-pin SOT-23 package
The TMP100-Q1 and TMP101-Q1 devices are digital temperature sensors designed for negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thermistor replacement. The devices offer a typical accuracy of ±1°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or look-up tables to derive the temperature. The on-chip, 12-bit ADC offers resolutions down to 0.0625°C. The devices are available in 6-Pin SOT-23 packages.
The TMP100-Q1 and TMP101-Q1 devices feature SMBus, Two-Wire, and I2C interface compatibility. The TMP100-Q1 device allows up to eight devices on one bus. The TMP101-Q1 device offers an SMBus Alert function with up to three devices per bus.
The TMP100-Q1 and TMP101-Q1 devices are designed for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications.
The TMP100-Q1 and TMP101-Q1 devices are specified for operation over a temperature range of −55°C to 125°C.
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | TMP100-Q1 and TMP101-Q1 Temperature Sensor With I2C and SMBus Interface with Alert Function in SOT-23 Package datasheet (Rev. B) | PDF | HTML | 17 Jun 2022 |
Technical article | How to maximize powertrain efficiency and reliability with high-accuracy temperatu | PDF | HTML | 10 May 2021 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
SOT-23 (DBV) | 6 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.