Product details

Local sensor accuracy (max) 1.5 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 2 Features ALERT Supply current (max) (µA) 21 Temp resolution (max) (bps) 12 Remote channels (#) 8 Addresses 4 Rating Space
Local sensor accuracy (max) 1.5 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 2 Features ALERT Supply current (max) (µA) 21 Temp resolution (max) (bps) 12 Remote channels (#) 8 Addresses 4 Rating Space
CFP (HKT) 16 72.136 mm² 10.16 x 7.1
  • QMLV Qualified: 5962R2021401VXC
    • Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
    • Single Event Latchup (SEL) Immune to 76 MeV·cm2 /mg at 125°C
    • Thermally Enhanced 16-Lead Ceramic HKT Package
  • 8-Channel Remote Diode Temperature Sensor Accuracy: ±1.5°C
  • Local Temperature Sensor Accuracy: ±1.5°C
  • Temperature Resolution: 0.0625°C
  • Logic Voltage Range: 1.7 V to 3.6 V
  • Supply Range: 1.7 V to 2.0 V
  • 67 µA Operating Current (1 SPS, All Channels Active)
  • 0.3 µA Shutdown Current
  • Remote Diode: Series Resistance Cancellation, η-Factor Correction, Offset Correction, and Diode Fault Detection
  • Register Lock Function Secures Key Registers
  • I2C or SMBus™ Compatible Two-Wire Interface With Pin-Programmable Address
  • QMLV Qualified: 5962R2021401VXC
    • Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
    • Single Event Latchup (SEL) Immune to 76 MeV·cm2 /mg at 125°C
    • Thermally Enhanced 16-Lead Ceramic HKT Package
  • 8-Channel Remote Diode Temperature Sensor Accuracy: ±1.5°C
  • Local Temperature Sensor Accuracy: ±1.5°C
  • Temperature Resolution: 0.0625°C
  • Logic Voltage Range: 1.7 V to 3.6 V
  • Supply Range: 1.7 V to 2.0 V
  • 67 µA Operating Current (1 SPS, All Channels Active)
  • 0.3 µA Shutdown Current
  • Remote Diode: Series Resistance Cancellation, η-Factor Correction, Offset Correction, and Diode Fault Detection
  • Register Lock Function Secures Key Registers
  • I2C or SMBus™ Compatible Two-Wire Interface With Pin-Programmable Address

The TMP9R00-SP device is a radiation-hardened, multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote and one local temperature zones can be monitored simultaneously, aggregating the temperature measurements in a system reducing design complexity. Typical use cases are monitoring temperature of different high power devices, such as MCUs, GPUs, ADCs, DACs and FPGAs. Advanced features such as series resistance cancellation, programmable ideality factor, temperature offset correction, and temperature limits are included to provide a robust thermal monitoring solution.

Each remote channel and the local channel have two independently programmable thresholds that trigger when the corresponding temperature exceeds the limit. A programmable hysteresis setting is available to avoid toggling around the threshold.

The TMP9R00-SP device provides high accuracy (±1.5°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 2.0 V), common two-wire interfaces (1.7 V to 3.6 V), and an operating temperature range from –55°C to 125°C and a remote junction temperature range from –55°C to 150°C.

The TMP9R00-SP device is a radiation-hardened, multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote and one local temperature zones can be monitored simultaneously, aggregating the temperature measurements in a system reducing design complexity. Typical use cases are monitoring temperature of different high power devices, such as MCUs, GPUs, ADCs, DACs and FPGAs. Advanced features such as series resistance cancellation, programmable ideality factor, temperature offset correction, and temperature limits are included to provide a robust thermal monitoring solution.

Each remote channel and the local channel have two independently programmable thresholds that trigger when the corresponding temperature exceeds the limit. A programmable hysteresis setting is available to avoid toggling around the threshold.

The TMP9R00-SP device provides high accuracy (±1.5°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 2.0 V), common two-wire interfaces (1.7 V to 3.6 V), and an operating temperature range from –55°C to 125°C and a remote junction temperature range from –55°C to 150°C.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Same functionality with different pin-out to the compared device
TMP461-SP ACTIVE Radiation-hardness-assured (RHA), high-accuracy remote and local temperature sensor 1-channel QMLV RHA option, with 1 remote and 1 local temperature measurement.

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 9
Type Title Date
* Data sheet TMP9R00-SP 9-Channel (8-Remote and 1-Local), High-Accuracy Temperature Sensor datasheet (Rev. A) PDF | HTML 04 Aug 2022
* Radiation & reliability report TMP9R00-SP Single-Event Effects (SEE) Radiation Test Report PDF | HTML 14 Aug 2023
* SMD TMP9R00-SP SMD 5962-20214 10 Jul 2023
* Radiation & reliability report TMP9R00-SP Total Ionizing Dose (TID) PDF | HTML 15 Aug 2022
Application brief DLA Approved Optimizations for QML Products (Rev. B) PDF | HTML 17 May 2024
Selection guide TI Space Products (Rev. J) 12 Feb 2024
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 31 Aug 2023
Application note Remote Temperature Transistor Sensor Selection Guide PDF | HTML 24 Mar 2021
Application note Measuring Die Temperature with Remote Diode Sensing in Space 10 Dec 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TMP9R01EVM — TMP9R01 evaluation module

The TMP9R01EVM is designed to provide a quick setup to evaluate the TMP9R01-SEP device and gain familiarity with the device down to the bit-by-bit register level. In addition to testing the device for common functionality, the evaluation module (EVM) also allows testing under radiation (...)
User guide: PDF | HTML
Not available on TI.com
Package Pins CAD symbols, footprints & 3D models
CFP (HKT) 16 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos