Product details

Package name DFN-0603 (X2SON) Peak pulse power (8/20 μs) (max) (W) 40 Vrwm (V) 5.5 Bi-/uni-directional Uni-Directional Number of channels 5 IO capacitance (typ) (pF) 9 IEC 61000-4-2 contact (±V) 15000 IEC 61000-4-5 (A) 3 Clamping voltage (V) 13 Dynamic resistance (typ) 0.8 Interface type Memory/SIM Card Breakdown voltage (min) (V) 6 IO leakage current (max) (nA) 100 Rating Catalog Operating temperature range (°C) -40 to 125
Package name DFN-0603 (X2SON) Peak pulse power (8/20 μs) (max) (W) 40 Vrwm (V) 5.5 Bi-/uni-directional Uni-Directional Number of channels 5 IO capacitance (typ) (pF) 9 IEC 61000-4-2 contact (±V) 15000 IEC 61000-4-5 (A) 3 Clamping voltage (V) 13 Dynamic resistance (typ) 0.8 Interface type Memory/SIM Card Breakdown voltage (min) (V) 6 IO leakage current (max) (nA) 100 Rating Catalog Operating temperature range (°C) -40 to 125
X2SON (DPF) 6 1 mm² 1 x 1
  • Provides System-Level ESD Protection for Low-
    Voltage I/O Interface
  • IEC 61000-4-2 Level 4
    • ±15 kV (Contact Discharge)
    • ±15 kV (Air-Gap Discharge)
  • Typical I/O Capacitance 7 pF (VIO = 2.5 V)
  • DC Breakdown Voltage: 6 V (Minimum)
  • Low Leakage Current: 100 nA (Maximum)
  • Low ESD Clamping Voltage
  • Industrial Temperature Range: –40°C to 125°C
  • IEC 61000-4-5 (Surge): 40 W (8/20-µs Pulse)
  • Small, Easy-to-Route DPF Package
  • Provides System-Level ESD Protection for Low-
    Voltage I/O Interface
  • IEC 61000-4-2 Level 4
    • ±15 kV (Contact Discharge)
    • ±15 kV (Air-Gap Discharge)
  • Typical I/O Capacitance 7 pF (VIO = 2.5 V)
  • DC Breakdown Voltage: 6 V (Minimum)
  • Low Leakage Current: 100 nA (Maximum)
  • Low ESD Clamping Voltage
  • Industrial Temperature Range: –40°C to 125°C
  • IEC 61000-4-5 (Surge): 40 W (8/20-µs Pulse)
  • Small, Easy-to-Route DPF Package

The TPD5E003 is a five-channel electrostatic discharge (ESD) transient voltage suppression (TVS) device. This device offers ±15-kV IEC contact and ±15-kV air-gap (level 4) ESD protection, and features five identical ESD clamping diodes that can be used to protect either five unidirectional (0 V to 5 V) I/O lines or four bidirectional (–5 V to 5 V) I/O lines. The compact DPF package is an industry standard and is convenient for component placement in
space-constrained applications. Typical application interfaces include SIM card interfaces, audio lines (mics, earphones, and speakerphones), SD interfaces, and keypads, or other buttons. Typical end equipment includes cell phones, tablets, remote controllers, and wearables.

The TPD5E003 is a five-channel electrostatic discharge (ESD) transient voltage suppression (TVS) device. This device offers ±15-kV IEC contact and ±15-kV air-gap (level 4) ESD protection, and features five identical ESD clamping diodes that can be used to protect either five unidirectional (0 V to 5 V) I/O lines or four bidirectional (–5 V to 5 V) I/O lines. The compact DPF package is an industry standard and is convenient for component placement in
space-constrained applications. Typical application interfaces include SIM card interfaces, audio lines (mics, earphones, and speakerphones), SD interfaces, and keypads, or other buttons. Typical end equipment includes cell phones, tablets, remote controllers, and wearables.

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Type Title Date
* Data sheet TPD5E003 Five-Channel Space-Saving ESD Protection Device datasheet (Rev. B) PDF | HTML 29 Sep 2015
User guide Reading and Understanding an ESD Protection Data Sheet (Rev. A) PDF | HTML 19 Sep 2023
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
User guide Generic ESD Evaluation Module User's Guide (Rev. A) PDF | HTML 27 Sep 2021
White paper Designing USB for short-to-battery tolerance in automotive environments 10 Feb 2016
Analog Design Journal Design Considerations for System-Level ESD Circuit Protection 25 Sep 2012

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ESDEVM — ESD evaluation module

The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
User guide: PDF | HTML
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Simulation model

TPD5E003 IBIS Model

SLVM738.ZIP (3 KB) - IBIS Model
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X2SON (DPF) 6 Ultra Librarian

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