TPS51604

ACTIVE

4-A, 28-V half bridge gate driver for synchronous buck high frequency CPU core power applications

Product details

Operating temperature range (°C) -40 to 105 Rating Catalog Input supply voltage (max) (V) 5.5 Features Dead time control, Synchronous Rectification Input supply voltage (min) (V) 4.5
Operating temperature range (°C) -40 to 105 Rating Catalog Input supply voltage (max) (V) 5.5 Features Dead time control, Synchronous Rectification Input supply voltage (min) (V) 4.5
WSON (DSG) 8 4 mm² 2 x 2
  • Reduced Dead-Time Drive Circuit for Optimized
    CCM
  • Automatic Zero Crossing Detection for Optimized
    DCM Efficiency
  • Multiple Low-Power Modes for Optimized Light-
    Load Efficiency
  • Optimized Signal Path Delays for High-Frequency
    Operation
  • Integrated BST Switch Drive Strength Optimized
    for Ultrabook FETs
  • Optimized for 5-V FET Drive
  • Conversion Input Voltage Range (VIN): 4.5 to 28 V
  • 2-mm × 2-mm, 8-Pin, WSON Thermal Pad
    Package
  • Reduced Dead-Time Drive Circuit for Optimized
    CCM
  • Automatic Zero Crossing Detection for Optimized
    DCM Efficiency
  • Multiple Low-Power Modes for Optimized Light-
    Load Efficiency
  • Optimized Signal Path Delays for High-Frequency
    Operation
  • Integrated BST Switch Drive Strength Optimized
    for Ultrabook FETs
  • Optimized for 5-V FET Drive
  • Conversion Input Voltage Range (VIN): 4.5 to 28 V
  • 2-mm × 2-mm, 8-Pin, WSON Thermal Pad
    Package

The TPS51604 drivers are optimized for high-frequency CPU VCORE applications. Advanced features such as reduced dead-time drive and auto zero crossing are used to optimize efficiency over the entire load range.

The SKIP pin provides the option of CCM operation to support controlled management of the output voltage. In addition, the TPS51604 supports two low-power modes. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). Paired with the appropriate TI controller, the drivers deliver an exceptionally high performance power supply system.

The TPS51604 device is packaged in a space saving, thermally-enhanced 8-pin, 2-mm × 2-mm WSON package and operates from –40°C to 105°C.

The TPS51604 drivers are optimized for high-frequency CPU VCORE applications. Advanced features such as reduced dead-time drive and auto zero crossing are used to optimize efficiency over the entire load range.

The SKIP pin provides the option of CCM operation to support controlled management of the output voltage. In addition, the TPS51604 supports two low-power modes. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). Paired with the appropriate TI controller, the drivers deliver an exceptionally high performance power supply system.

The TPS51604 device is packaged in a space saving, thermally-enhanced 8-pin, 2-mm × 2-mm WSON package and operates from –40°C to 105°C.

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Technical documentation

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Type Title Date
* Data sheet TPS51604 Synchronous Buck FET Driver for High-Frequency CPU Core Power datasheet (Rev. B) PDF | HTML 23 Oct 2015
Application brief External Gate Resistor Selection Guide (Rev. A) 28 Feb 2020
Application brief Understanding Peak IOH and IOL Currents (Rev. A) 28 Feb 2020
More literature Fundamentals of MOSFET and IGBT Gate Driver Circuits (Replaces SLUP169) (Rev. A) 29 Oct 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

TPS51604 PSpice Transient Model

SLUM641.ZIP (34 KB) - PSpice Model
Reference designs

TIDA-00448 — Flexible High Current IGBT Gate Driver with Reinforced Digital Isolator Reference Design

The TIDA-00448 reference design is an isolated IGBT gate driver with bipolar gate voltages intended for driving  high power IGBT’s requiring high peak gate current up to 40 A. TI’s NexFET power blocks which scales in this range, with same package, enables single design to be used (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
WSON (DSG) 8 Ultra Librarian

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