TPS54618-Q1
- Qualified for Automotive Applications
- AEC Q-100 Qualified With the Following Results:
- Device Temperature Grade 1: Ambient Operating Temperature Range of –40°C to +125°C
- Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C4B
- Two 12-mΩ (typical) MOSFETs for high efficiency at 6-A loads
- 300-kHz to 2-MHz switching frequency
- 0.8-V ±1% Voltage reference over temperature (–40°C to +150°C)
- Synchronizes to external clock
- Adjustable slow start and sequencing
- UV and OV power-good output
- Thermally enhanced 3-mm × 3-mm, 16-pin WQFN package
- Create a custom design using the TPS54618-Q1 with the WEBENCH® Power Designer
The TPS54618-Q1 device is a full-featured 6-V, 6-A, synchronous step-down current-mode converter with two integrated MOSFETs.
The TPS54618-Q1 enables small designs by integrating the MOSFETs, implementing current-mode control to reduce external component count, reducing inductor size by enabling up to 2-MHz switching frequency, and minimizing the IC footprint with a small, 3-mm × 3-mm, thermally-enhanced WQFN package.
The TPS54618-Q1 provides accurate regulation for a variety of loads with an accurate ±1% voltage reference (VREF) over temperature.
Efficiency is maximized through the integrated
12-mΩ MOSFETs and 515-µA typical supply current. Using the enable pin, shutdown supply current is reduced to 5.5-µA by entering a shutdown mode.
Undervoltage lockout is internally set at 2.6 V, but can be increased by programming the threshold with a resistor network on the enable pin. The output-voltage start-up ramp is controlled by the slow-start pin. An open-drain power-good signal indicates the output is within 93% to 107% of its nominal voltage.
Frequency foldback and thermal shutdown protect the device during an overcurrent condition.
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | TPS54618-Q1 Automotive 2.95-V to 6-V, 6-A, 2-MHz Synchronous Buck Converter datasheet (Rev. E) | PDF | HTML | 24 May 2019 |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location