TUSB9261-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified with the Following Exceptions:
- Device CDM ESD Classification Level C3
- Ideal for bridging Serial ATA (SATA) Devices, Such
as Hard Disk Drives (HDD), Solid State Drives (SSD),
or Optical Drives (OD) to Universal Serial Bus (USB) - USB Interface
- Integrated Transceiver Supports SS/HS/FS Signaling
- Best in Class Adaptive Equalizer
- Allows for Greater Jitter Tolerance in the Receiver
- USB Class Support
- USB Attached SCSI Protocol (UASP) for HDD and SSD
- USB Mass Storage Class Bulk-Only Transport (BOT)
Including Support for Error Conditions Per the
13 Cases (Defined in the BOT Specification) - USB Bootability Support
- USB Human Interface Device (HID)
- Supports Firmware Update Via USB Using a TI Provided Application
- SATA Interface
- Serial ATA Specification Revision 2.6 Supporting gen1 and
gen2 Data Rates - Supports hot plug
- Supports Mass-Storage Devices Compatible with the ATA/ATAPI-8
Specification
- Serial ATA Specification Revision 2.6 Supporting gen1 and
- Integrated ARM Cortex M3 Core
- Customizable Application Code Loaded From EEPROM Via SPI Interface
- Two Additional SPI Port Chip Selects for Peripheral Connection
- Up to 5 GPIOs for End-User Configuration via HID
- Serial Communications Interface for Debug (UART)
- General Features
- Integrated Spread Spectrum Clock Generation Enables Operation
from a Single Low Cost Crystal or Clock Oscillator- Supports 20, 25, 30 or 40 MHz
- JTAG Interface for IEEE1149.1 and IEEE1149.6 Boundary Scan
- Available in a Fully RoHS Compliant Package (PAP)
- Integrated Spread Spectrum Clock Generation Enables Operation
The TUSB9261-Q1 is an ARM cortex M3 microcontroller based Universal Serial Bus (USB) 3.0 to Serial ATA (SATA) bridge. It provides the necessary hardware and firmware to implement a USB Attached SCSI Protocol (UASP) compliant mass storage device suitable for bridging SATA compatible hard disk drives (HDD) and solid state disk drives (SSD) to a USB 3.0 bus. The firmware also implements the mass storage class bulk-only transport (BOT) for bridging optical drives and other compatible SATA devices to the USB bus. In addition to UASP and BOT support,a USB human interface device (HID) interfaces is supported for control of the general purpose input/ouput (GPIO). The SATA interface supports gen1 (1.5-Gbps) and gen2 (3.0-Gbps) for cable lengths up to 2 meters.
The device is available in a 64-pin HTQFP package and is designed for operation over the industrial temperature range of –40°C to 85°C.
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | TUSB9261-Q1 USB 3.0 to SATA Bridge datasheet (Rev. A) | 31 Jan 2014 | |
* | Errata | TUSB9261 Errata (Rev. B) | 20 Dec 2012 | |
User guide | TUSB9261 DEMO User's Guide (Rev. A) | 09 Dec 2014 | ||
Application note | TUSB9261 Implementation Guide (Rev. E) | 09 Dec 2014 | ||
User guide | TUSB9260 Flash Burner - User Guide (Rev. D) | 24 Oct 2013 | ||
User guide | TUSB926x SpeedBoost Monitor User's Guide | 23 Sep 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
TUSB9261DEMO — TUSB9261 demonstration kit
The TUSB9261DEMO board is a bridge between a SuperSpeed USB (USB 3.0) bus and a Serial–ATA (SATA) development kit. The TUSB9261DEMO is used to evaluate system compatibility. It provides a TUSB9261 hardware for connection to a SATA device such as a solid state drive, hard disk drive, DVD (...)
SLLC414 — TUSB926x FlashBurner Utility
Supported products & hardware
Products
USB hubs & controllers
PSPICE-FOR-TI — PSpice® for TI design and simulation tool
TINA-TI — SPICE-based analog simulation program
TIDA-00148 — USB 2.0/3.0 mass storage bridge for automotive infotainment systems
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
HTQFP (PAP) | 64 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.