TXS0202

ACTIVE

Voltage-Level Shifter for IC-USB Interface

Product details

Technology family TXS Applications Interchip USB Rating Catalog Operating temperature range (°C) -40 to 85
Technology family TXS Applications Interchip USB Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25
  • No Direction Control Signal Required
  • VCCA, VCCB Supply Voltage: 1.65 V to 3.6 V
  • Meets All Requirements of the IC-USB Standard
  • Small Packages: WCSP
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Ioff Supports Partial-Power-Down Mode Operation
  • ESD Performance
    • A port (Host-Side)
      • 2000-V Human-Body Model
      • 100-V Machine Model
      • 500-V Charged-Device Model
    • B port (Peripheral-Side)
      • >4kV HBM

  • No Direction Control Signal Required
  • VCCA, VCCB Supply Voltage: 1.65 V to 3.6 V
  • Meets All Requirements of the IC-USB Standard
  • Small Packages: WCSP
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Ioff Supports Partial-Power-Down Mode Operation
  • ESD Performance
    • A port (Host-Side)
      • 2000-V Human-Body Model
      • 100-V Machine Model
      • 500-V Charged-Device Model
    • B port (Peripheral-Side)
      • >4kV HBM

The TXS0202 is a 2-bit voltage level translator optimized for use in Interchip USB (IC-USB) applications. VCCA and VCCB can each operate over the full range of 1.65 V to 3.6 V. The device has been designed to maintain cross-over skew to be less than 1 ns. The device has integrated pull-ups and pull-down resistors to aid in the protocol communication between a host and a peripheral. The translator is a buffered auto-direction sensing type translator. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The TXS0202 is a 2-bit voltage level translator optimized for use in Interchip USB (IC-USB) applications. VCCA and VCCB can each operate over the full range of 1.65 V to 3.6 V. The device has been designed to maintain cross-over skew to be less than 1 ns. The device has integrated pull-ups and pull-down resistors to aid in the protocol communication between a host and a peripheral. The translator is a buffered auto-direction sensing type translator. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 6
Type Title Date
* Data sheet A Inter Chip-USB VOLTAGE LEVEL TRANSLATOR datasheet (Rev. A) 27 Jun 2011
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12 Jul 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 Jul 2024
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
More literature Voltage-Level Translation Guide (Rev. H) 31 Aug 2015
User guide TXS0202 Evaluation Module 24 Jun 2011

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TXS0202EVM — TXS0202 Evaluation Module

The TXS0202 EVM was created to allow simplified evaluation and prototyping without the need for full board development. This EVM provides peripheral header style pads for probing and signal connection to each device pin. Headers are labeled with the corresponding pin number.

User guide: PDF
Not available on TI.com
Simulation model

TXS0202 IBIS Model

SLEM002.ZIP (27 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
DSBGA (YZP) 8 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos