ZHCSN33B November   2017  – February 2023 DLP550JE

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Window Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Power Interface
      2. 7.2.2 Timing
    3. 7.3 Optical Interface and System Image Quality Considerations
      1. 7.3.1 Numerical Aperture and Stray Light Control
      2. 7.3.2 Pupil Match
      3. 7.3.3 Illumination Overfill
    4. 7.4 Micromirror Array Temperature Calculation
      1. 7.4.1 Micromirror Array Temperature Calculation
    5. 7.5 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.5.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.5.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.5.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.5.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 DMD Power-Up and Power-Down Procedures
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 10.1.2 Device Nomenclature
      3. 10.1.3 Device Markings
    2. 10.2 支持资源
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision A (September 2022) to Revision B (February 2023)

  • 将控制器更新为 DLPC4430，所有芯片组元件均为有效链接Go
  • 将控制器更新为 DLPC4430，将 DMD 链接到文档Go
  • Updated this sectionGo
  • Updated controller to DLPC4430, updated the application diagramGo
  • Updated controller to DLPC4430Go
  • Updated controller to DLPC4430Go

Changes from Revision * (November 2017) to Revision A (September 2022)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 将文档状态从：“预告信息”更改为：量产数据Go
  • 更新了措辞，将“MOEMS”替换为“MEMS”Go
  • Updated wording in "Input Voltages" in Section 6.1 Go
  • Updated DMD Thermal Test Points illustrationGo
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