ZHCSAQ1D February   2013  – July 2022 INA231

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: I2C Bus
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic Analog-to-Digital Converter (ADC) Functions
        1. 8.3.1.1 Power Calculation
        2. 8.3.1.2 ALERT Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Averaging and Conversion Time Considerations
    5. 8.5 Programming
      1. 8.5.1 Configure, Measure, and Calculate Example
      2. 8.5.2 Programming the Power Measurement Engine
        1. 8.5.2.1 Calibration Register and Scaling
      3. 8.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 8.5.4 Default INA231 Settings
      5. 8.5.5 Writing to and Reading from the INA231
        1. 8.5.5.1 Bus Overview
          1. 8.5.5.1.1 Serial Bus Address
          2. 8.5.5.1.2 Serial Interface
        2. 8.5.5.2 High-Speed I2C Mode
      6. 8.5.6 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Configuration Register (00h, Read/Write)
        1. 8.6.1.1 AVG Bit Settings [11:9]
        2. 8.6.1.2 VBUS CT Bit Settings [8:6]
        3. 8.6.1.3 VSH CT Bit Settings [5:3]
        4. 8.6.1.4 Mode Settings [2:0]
      2. 8.6.2 Shunt Voltage Register (01h, Read-Only)
      3. 8.6.3 Bus Voltage Register (02h, Read-Only)
      4. 8.6.4 Power Register (03h, Read-Only)
      5. 8.6.5 Current Register (04h, Read-Only)
      6. 8.6.6 Calibration Register (05h, Read/Write)
      7. 8.6.7 Mask/Enable Register (06h, Read/Write)
      8. 8.6.8 Alert Limit Register (07h, Read/Write)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Filtering and Input Considerations
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YFF|12
  • YFD|12
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (March 2018) to Revision D (July 2022)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Added footnote to B2 and C2 pinsGo
  • Changed value from 40 ms to 40 µs in sentence: Full recovery from power-down mode requires 40 µsGo
  • Moved the Power Supply Recommendations and Layout sections to the Application and Implementation sectionGo

Changes from Revision B (August 2017) to Revision C (March 2018)

  • 添加了 B 版本器件和相关内容Go

Changes from Revision A (June 2017) to Revision B (August 2017)

  • Changed NC pin description from "No internal connection" to "Do not connect, leave floating" Go
  • Changed SCL max value from VS + 0.3 V to 6 V in Absolute Maximum Ratings tableGo
  • Added text to end of Layout Guidelines section clarifying no connection of NC pinsGo

Changes from Revision * (February 2013) to Revision A (June 2017)

  • 添加了器件信息、建议运行条件 和 ESD 等级 表，以及详细说明、应用和实施、电源相关建议、布局、器件和文档支持 和机械、封装和可订购信息 部分Go
  • 向数据表添加了封装高度为 0.4mm 的全新 WSCP-12 (YFD) 封装和相关内容Go
  • Added operating ambient temperature, TA to Absolute Maximum Ratings tableGo
  • Added new note 1 to Timing Requirements: I2C Bus section Go
  • Added test condition to Figure 2 Go
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