PCB layout is a critical portion of good power supply design. There are several paths that conduct high slew-rate currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise and EMI or degrade the power supply performance.

• To help eliminate these problems, bypass the VIN pin to GND with a low-ESR ceramic bypass capacitor with a high-quality dielectric. Place C_IN as close as possible to the  LM5013-Q1 VIN and GND pins. Grounding for both the input and output capacitors must consist of localized top-side planes that connect to the GND pin and GND PAD.
• Minimize the loop area formed by the input capacitor connections to the VIN and GND pins.
• Locate the inductor and Schottky diode close to the SW pin. Minimize the area of the SW trace or plane to prevent excessive capacitive coupling.
• Place the Schottky diode anode terminal in close proximity to the input capacitor ground/return.
• Tie the GND pin directly to the power pad under the device and to a heat-sinking PCB ground plane.
• Use a ground plane in one of the middle layers as a noise shielding and heat dissipation path.
• Place a single-point ground connection to the plane. Route the ground connections for the feedback, soft start, and enable components to the ground plane. This prevents any switched or load currents from flowing in analog ground traces. If not properly handled, poor grounding results in degraded load regulation or erratic output voltage ripple behavior.
• Make V_IN, V_OUT, and ground bus connections as wide as possible. This reduces any voltage drops on the input or output paths of the converter and maximizes efficiency.
• Minimize trace length to the FB pin. Place both feedback resistors, R_FB1 and R_FB2, close to the FB pin. Place C_FF (if needed) directly in parallel with R_FB1. If output setpoint accuracy at the load is important, connect the V_OUT sense at the load. Route the V_OUT sense path away from noisy nodes and preferably through a layer on the other side of a grounded shielding layer.
• The RON pin is sensitive to noise. Thus, locate the R_RON resistor as close as possible to the device and route with minimal lengths of trace. The parasitic capacitance from RON to GND must not exceed 20 pF.
• Provide adequate heat sinking for the LM5013-Q1 to keep the junction temperature below 150°C. For operation at full rated load, the top-side ground plane is an important heat-dissipating area. Use an array of heat-sinking vias to connect the exposed pad to the PCB ground plane. If the PCB has multiple copper layers, these thermal vias must also be connected to inner layer heat-spreading ground planes.
• Reference Section 10.2.