ZHCSO42B December   2015  – July 2021 LM53625-Q1 , LM53635-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Timing Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Control Scheme
    3. 8.3 Feature Description
      1. 8.3.1 RESET Flag Output
      2. 8.3.2 Enable and Start-Up
      3. 8.3.3 Soft-Start Function
      4. 8.3.4 Current Limit
      5. 8.3.5 Hiccup Mode
      6. 8.3.6 Synchronizing Input
      7. 8.3.7 Undervoltage Lockout (UVLO) and Thermal Shutdown (TSD)
      8. 8.3.8 Input Supply Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 AUTO Mode
      2. 8.4.2 FPWM Mode
      3. 8.4.3 Dropout
      4. 8.4.4 Input Voltage Frequency Foldback
    5. 8.5 Spread-Spectrum Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 General Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 External Components Selection
            1. 9.2.1.2.1.1 Input Capacitors
              1. 9.2.1.2.1.1.1 Input Capacitor Selection
            2. 9.2.1.2.1.2 Output Inductors and Capacitors Selection
              1. 9.2.1.2.1.2.1 Inductor Selection
              2. 9.2.1.2.1.2.2 Output Capacitor Selection
          2. 9.2.1.2.2 Setting the Output Voltage
            1. 9.2.1.2.2.1 FB for Adjustable Versions
          3. 9.2.1.2.3 VCC
          4. 9.2.1.2.4 BIAS
          5. 9.2.1.2.5 CBOOT
          6. 9.2.1.2.6 Maximum Ambient Temperature
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Fixed 5-V Output for USB-Type Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Fixed 3.3-V Output
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
      4. 9.2.4 Adjustable Output
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RNL|22
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)LM53625/35-Q1UNIT
RNL (VQFN)
22 PINS
RθJAJunction-to-ambient thermal resistance29.4°C/W
RθJCJunction-to-case (top) thermal resistance14.2°C/W
RθJBJunction-to-board thermal resistance5.4°C/W
ψJTJunction-to-top characterization parameter1.2°C/W
ψJBJunction-to-board characterization parameter5.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance2.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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