SNOS738I April   1995  – January 2017 LM9061 , LM9061-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM9061
    3. 6.3 ESD Ratings: LM9061-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 MOSFET Gate Drive
      2. 7.3.2 Basic Operation
      3. 7.3.3 Turn On and Turn Off Characteristics
      4. 7.3.4 Lossless Overcurrent Protection
      5. 7.3.5 Delay Timer
        1. 7.3.5.1 Minimum Delay Time
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 Reverse Battery
      8. 7.3.8 Low Battery
      9. 7.3.9 Increasing MOSFET Turnon Time
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VCC > 30 V
      2. 7.4.2 Operation With VCC < 6.2 V
      3. 7.4.3 Operation With ON/OFF Control
      4. 7.4.4 MOSFET Latch-OFF
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TITLE NEEDED
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Bidirectional Applications
        1. 8.2.2.1 Back-to-Back MOSFET Configuration
          1. 8.2.2.1.1 Application Curve
        2. 8.2.2.2 Bidirectional Switch With Reverse Overcurrent Protection
          1. 8.2.2.2.1 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from H Revision (January 2015) to I Revision

  • Updated data sheet text to the latest TI documentation and translations standards and flowGo
  • Added Bidirectional Applications section Go

Changes from G Revision (November 2014) to H Revision

  • Changed Handling Ratings to ESD Ratings Go
  • Added content to Application and Implementation sectionGo
  • Changed Layout Example figure Go

Changes from F Revision (April 1995) to G Revision

  • Added AEC-Q100 Qualification Go
  • Added Handling Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from E Revision (April 2013) to F Revision

  • Changed layout of National Data Sheet to TI formatGo
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