SNVS358R July   2005  – June 2016 LP5900

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Output and Input Capacitor, Recommended Specifications
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 No-Load Stability
      2. 7.3.2 Enable Control
      3. 7.3.3 Low Noise Output
      4. 7.3.4 Thermal-Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with Enable Control
      2. 7.4.2 Operation with Minimum Operating Input Voltage (VIN)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation
        2. 8.2.2.2 External Capacitors
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
          3. 8.2.2.2.3 Capacitor Characteristics
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 DSBGA Mounting
    4. 10.4 DSBGA Light Sensitivity
    5. 10.5 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Q Revision (February 2015) to R Revision

  • Changed "Linear Regulator" to "LDO" in title and first sentence of Description Go

Changes from P Revision (December 2014) to Q Revision

  • Added NC and Thermal Pad descriptions in Pin Functions Go
  • Changed Handling Ratings to ESD Ratings table format; move storage temp spec to Ab Max; delete soldering info (in POA)Go
  • Changed Unit for Line and Load regulation Go
  • Changed Il to IoutGo
  • Added WSON Mounting subsection Go
  • Added another related doc link Go

Changes from O Revision (April 2013) to P Revision

  • Added Pin Configuration and Functions section, Handling Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; updated pin names and thermal information Go

Changes from N Revision (April 2013) to O Revision

  • Changed layout of National Data Sheet to TI formatGo