ZHCSCK8G May   2014  – October 2017 LP8860-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     系统效率
  4. 4 修订历史记录
  5. 5 器件比较表
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Current Sinks Electrical Characteristics
    7. 7.7  Boost Converter Characteristics
    8. 7.8  Logic Interface Characteristics
    9. 7.9  VIN Undervoltage Protection (VIN_UVLO)
    10. 7.10 VDD Undervoltage Protection (VDD_UVLO)
    11. 7.11 VIN Overvoltage Protection (VIN_OVP)
    12. 7.12 VIN Overcurrent Protection (VIN_OCP)
    13. 7.13 Power-Line FET Control Electrical Characteristics
    14. 7.14 External Temp Sensor Control Electrical Characteristics
    15. 7.15 I2C Serial Bus Timing Parameters (SDA, SCLK)
    16. 7.16 SPI Timing Requirements
    17. 7.17 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Boost Controller
      2. 8.1.2 LED Output Configurations
      3. 8.1.3 Display Mode
      4. 8.1.4 Cluster Mode
      5. 8.1.5 Hybrid Dimming
      6. 8.1.6 Charge Pump and Square Waveform (SQW) Output
      7. 8.1.7 Power-Line FET
      8. 8.1.8 Protection Features
      9. 8.1.9 Advanced Thermal Protection Features
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clock Generation
        1. 8.3.1.1 LED PWM Clock Generation With VSYNC
        2. 8.3.1.2 LED PWM Frequency and Resolution
      2. 8.3.2 Brightness Control (Display Mode)
        1. 8.3.2.1 PWM Input Duty Cycle Based Control
        2. 8.3.2.2 Brightness Register Control
        3. 8.3.2.3 PWM Input Duty × Brightness Register
        4. 8.3.2.4 PWM-Input Direct Control
        5. 8.3.2.5 Brightness Slope
        6. 8.3.2.6 LED Dimming Methods
        7. 8.3.2.7 PWM Calculation Data Flow for Display Mode
      3. 8.3.3 LED Output Modes and Phase Shift PWM (PSPWM) Scheme
      4. 8.3.4 LED Current Setting
      5. 8.3.5 Cluster Mode
      6. 8.3.6 Boost Controller
      7. 8.3.7 Charge Pump
      8. 8.3.8 Powerline Control FET
      9. 8.3.9 Protection and Fault Detection Modes
        1. 8.3.9.1 LED Fault Comparators and Adaptive Boost Control
        2. 8.3.9.2 LED Current Dimming With Internal Temperature Sensor
        3. 8.3.9.3 LED Current Limitation With External NTC Sensor
        4. 8.3.9.4 LED Current Dimming With External NTC Sensor
        5. 8.3.9.5 Protection Feature and Fault Summary
    4. 8.4 Device Functional Modes
      1. 8.4.1 Standby Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 Fault Recovery State
      4. 8.4.4 Start-Up and Shutdown Sequences
    5. 8.5 Programming
      1. 8.5.1 EEPROM
      2. 8.5.2 Serial Interface
        1. 8.5.2.1 SPI Interface
        2. 8.5.2.2 I2C Serial Bus Interface
          1. 8.5.2.2.1 Interface Bus Overview
          2. 8.5.2.2.2 Data Transactions
          3. 8.5.2.2.3 Acknowledge Cycle
          4. 8.5.2.2.4 Acknowledge After Every Byte Rule
          5. 8.5.2.2.5 Addressing Transfer Formats
          6. 8.5.2.2.6 Control Register Write Cycle
          7. 8.5.2.2.7 Control Register Read Cycle
    6. 8.6 Register Maps
      1. 8.6.1 Register Bit Explanations
        1. 8.6.1.1  Display/Cluster1 Brightness Control MSB
        2. 8.6.1.2  Display/Cluster1 Brightness Control LSB
        3. 8.6.1.3  Display/Cluster1 Output Current MSB
        4. 8.6.1.4  Display/Cluster1 Output Current LSB
        5. 8.6.1.5  Cluster2 Brightness Control MSB
        6. 8.6.1.6  Cluster2 Brightness Control LSB
        7. 8.6.1.7  Cluster2 Output Current
        8. 8.6.1.8  Cluster3 Brightness Control MSB
        9. 8.6.1.9  Cluster3 Brightness Control LSB
        10. 8.6.1.10 Cluster3 Output Current
        11. 8.6.1.11 Cluster4 Brightness Control MSB
        12. 8.6.1.12 Cluster4 Brightness Control LSB
        13. 8.6.1.13 Cluster4 Output Current
        14. 8.6.1.14 Configuration
        15. 8.6.1.15 Status
        16. 8.6.1.16 Fault
        17. 8.6.1.17 LED Fault
        18. 8.6.1.18 Fault Clear
        19. 8.6.1.19 Identification
        20. 8.6.1.20 Temp MSB
        21. 8.6.1.21 Temp LSB
        22. 8.6.1.22 Display LED Current MSB
        23. 8.6.1.23 Display LED Current LSB
        24. 8.6.1.24 Display LED PWM MSB
        25. 8.6.1.25 Display LED PWM LSB
        26. 8.6.1.26 EEPROM Control
        27. 8.6.1.27 EEPROM Unlock Code
      2. 8.6.2 EEPROM Bit Explanations
        1. 8.6.2.1  EEPROM Register 0
        2. 8.6.2.2  EEPROM Register 1
        3. 8.6.2.3  EEPROM Register 2
        4. 8.6.2.4  EEPROM Register 3
        5. 8.6.2.5  EEPROM Register 4
        6. 8.6.2.6  EEPROM Register 5
        7. 8.6.2.7  EEPROM Register 6
        8. 8.6.2.8  EEPROM Register 7
        9. 8.6.2.9  EEPROM Register 8
        10. 8.6.2.10 EEPROM Register 9
        11. 8.6.2.11 EEPROM Register 10
        12. 8.6.2.12 EEPROM Register 11
        13. 8.6.2.13 EEPROM Register 12
        14. 8.6.2.14 EEPROM Register 13
        15. 8.6.2.15 EEPROM Register 14
        16. 8.6.2.16 EEPROM Register 15
        17. 8.6.2.17 EEPROM Register 16
        18. 8.6.2.18 EEPROM Register 17
        19. 8.6.2.19 EEPROM Register 18
        20. 8.6.2.20 EEPROM Register 19
        21. 8.6.2.21 EEPROM Register 20
        22. 8.6.2.22 EEPROM Register 21
        23. 8.6.2.23 EEPROM Register 22
        24. 8.6.2.24 EEPROM Register 23
        25. 8.6.2.25 EEPROM Register 24
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application for Display Backlight
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Inductor Selection
          2. 9.2.1.2.2  Output Capacitor Selection
          3. 9.2.1.2.3  Input Capacitor Selection
          4. 9.2.1.2.4  Charge Pump Output Capacitor
          5. 9.2.1.2.5  Charge Pump Flying Capacitor
          6. 9.2.1.2.6  Diode
          7. 9.2.1.2.7  Boost Converter Transistor
          8. 9.2.1.2.8  Boost Sense Resistor
          9. 9.2.1.2.9  Power Line Transistor
          10. 9.2.1.2.10 Input Current Sense Resistor
          11. 9.2.1.2.11 Filter Component Values
            1. 9.2.1.2.11.1 Critical Components for Design
        3. 9.2.1.3 Application Performance Plots
      2. 9.2.2 Low VDD Voltage and Combined Output Mode Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Performance Plots
      3. 9.2.3 High Output Voltage Application
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Performance Plots
      4. 9.2.4 High Output Current Application
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Performance Plots
      5. 9.2.5 Three-Channel Configuration Without Serial Interface
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
        3. 9.2.5.3 Application Performance Plots
      6. 9.2.6 Solution With Minimum External Components
        1. 9.2.6.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • VFP|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from F Revision (July 2017) to G Revision

  • 使用更详细的封装图进行了更新Go

Changes from E Revision (November 2016) to F Revision

  • Changed placement of "7" data hold time in Figure 2Go
  • Deleted "The LP8860-Q1 doesn’t support incremental addressing." after Table 20Go
  • Changed "short" to "open" in DRV_HEADER[2:0] row, EEPROM Register 4Go

Changes from D Revision (September 2016) to E Revision

  • Deleted 4-A row from VOCP in VIN Overcurrent Protection (VIN_OCP) tableGo
  • Changed "+ 150 mA" to "× 150 mA" in eq. 8 Go
  • Deleted "01/4A" row from Input voltage overcurrent protection in Table 16Go
  • Deleted duplicate of Figure 42 "State Diagram" Go
  • Changed "open" to "short" in DRV_LED_FAULT_THR[1:0] row, EEPROM Register 4Go
  • Changed "nit" to "not" - correct typoGo
  • Deleted "01 = 4 A" from PL_SD_LEVEL[1:0] in EEPROM Register 10Go
  • 更新了 POA 中的可订购选项Go
  • 在 POA 中添加了预生产“R”可订购选项Go

Changes from C Revision (December 2015) to D Revision

  • Changed 数据表标题Go
  • Changed 略微修改了“特性”项目中的措辞Go
  • Deleted “安全和Go
  • Changed “公差 特性”至“诊断”Go
  • Deleted “SPI 或 I2C 接口”Go
  • Added 附加应用Go
  • Changed “高开关”至“宽范围可调”Go
  • Deleted 一些措辞（描述部分） 使其更加简洁；已重新编写最后一句话Go
  • Added 器件比较表Go
  • Deleted Table 19 "Default EEPROM Context" - this information now in SNVA757, available in mysecureSW only Go

Changes from B Revision (March 2015) to C Revision

  • Added 特性项目修改：汽车Go
  • Changed “安全”至“故障检测”Go
  • Changed 简化原理图中的“高达 40V”至“高达 48V” Go
  • Changed SPI Write Cycle and SPI Read Cycle diagrams Go

Changes from A Revision (June 2014) to B Revision

  • Changed EXT_TEMP_MINUS[1:0] from "2, 6, 10, 14 μA" to "1, 5, 9, 13 µA"Go
  • Changed values for EXT_TEMP_MINUS from "2, 6, 10, 14 µA" to '1, 5, 9, 13 µA"Go
  • Added 文档支持部分Go

Changes from * Revision (May 2014) to A Revision

  • Changed first sentence in paragraph beginning "EEPROM bits are intended to be set..." to 2 separate sentences Go
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