2 修订历史记录
Changes from November 3, 2015 to September 20, 2018
- 更改了器件信息 表中 DSBGA 封装的封装尺寸条目Go
- Added Section 3.1, Related ProductsGo
- Removed D and E dimension lines from the YFF pinout (for package dimensions, see the Mechanical Data in Section 8)Go
- Added typical conditions statements at the beginning of Section 5, SpecificationsGo
- Changed the MIN value of the V(DVCC_BOR_hys) parameter from 60 mV to 50 mV in Section 5.20, PMM, Brownout Reset (BOR)Go
- Updated notes (1) and (2) and added note (3) in Section 5.26, Wake-up Times From Low-Power Modes and ResetGo
- Removed ADC12DIV from the formula for the TYP value in the second row of the tCONVERT parameter in Section 5.36, 12-Bit ADC, Timing Parameters, because ADC12CLK is after divisionGo
- Added second row for tEN_CMP with Test Conditions of "CBPWRMD = 10" and MAX value of 100 µs in Section 5.42, Comparator_BGo
- Renamed FCTL4.MGR0 and MGR1 bits in the fMCLK,MGR parameter in Section 5.48, Flash Memory, to be consistent with header filesGo
- Throughout document, changed all instances of "bootstrap loader" to "bootloader"Go
- Added YFF pin numbers to Table 6-11, TA0 Signal ConnectionsGo
- Added YFF pin numbers to Table 6-12, TA1 Signal ConnectionsGo
- Added YFF pin numbers to Table 6-13, TA2 Signal ConnectionsGo
- 已将先前的“开发工具支持”部分替换为“Section 7.3、工具与软件”Go
- 更改了格式并添加内容至Section 7.4文档支持Go