ZHCSK40E August   2019  – August 2024 OPA810

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 10 V
    6. 6.6  Electrical Characteristics: 24 V
    7. 6.7  Electrical Characteristics: 5 V
    8. 6.8  Typical Characteristics: VS = 10 V
    9. 6.9  Typical Characteristics: VS = 24 V
    10. 6.10 Typical Characteristics: VS = 5 V
    11. 6.11 Typical Characteristics: ±2.375-V to ±12-V Split Supply
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 OPA810 Architecture
      2. 7.3.2 ESD Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (±2.375 V to ±13.5 V)
      2. 7.4.2 Single-Supply Operation (4.75 V to 27 V)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Amplifier Gain Configurations
      2. 8.1.2 Selection of Feedback Resistors
      3. 8.1.3 Noise Analysis and the Effect of Resistor Elements on Total Noise
    2. 8.2 Typical Applications
      1. 8.2.1 Transimpedance Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 High-Z Input Data Acquisition Front-End
      3. 8.2.3 Multichannel Sensor Interface
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 第三方米6体育平台手机版_好二三四免责声明
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DBV|5
  • DCK|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision D (August 2020) to Revision E (August 2024)

  • 更新了封装信息 表并添加了新的注释 2Go
  • Updated table note 1 in Absolute Maximum Ratings Go
  • Updated CDM specification text in ESD Ratings Go
  • Updated Figure 6-49, Open-Loop Output Impedance vs Frequency, with corrected dataGo

Changes from Revision C (July 2020) to Revision D (August 2020)

  • 删除了选择性披露标题，并在第 1 页中添加了顶部导航标题Go

Changes from Revision B (June 2020) to Revision C (July 2020)

  • 将 DCK 封装的状态从预发布 更改为量产 Go

Changes from Revision A (December 2019) to Revision B (June 2020)

  • 将 DBV 封装的状态从预发布 更改为量产 Go
  • Added noise corner information to 10 V, 24 V and 5 V electrical characteristics tablesGo
  • Changed offset voltage test conditions for 10 V, 24 V and 5 V supplies for SOIC, SOT23 and SC70 packages.Go
  • Updated Figure 62. Noninverting Amplifier Go

Changes from Revision * (August 2019) to Revision A (December 2019)

  • 将文档状态从预告信息 更改为量产数据 Go
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