4 Revision History
Changes from Revision A (January 2017) to Revision B (March 2022)
- 更新了整个文档中的表格、图和交叉参考的编号格式Go
- Added the Thermal Package information to the Pin Functions
tableGo
- Added TFP401A-Q1 to the Imax vs Input Frequency
figureGo
- Added sentence to end of first
paragraph that recommends soldering package
thermal pad to PCB in order to minimize stress on
peripheral pinsGo
Changes from Revision * (November 2012) to Revision A (January 2017)
- 添加了器件信息 表、引脚配置和功能 部分、ESD 等级 表、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
- 将特性 部分中的“器件 HBM ESD 分类等级 C3B”更改为“器件 CDM ESD 分类等级 C3”Go
- Changed the Operating free-air temperature MIN value From: 0°C To: –40°C and the MAX value From: 70°C To: 85°C in the Recommended Operating Conditions
Go
- Changed the Thermal Information table valuesGo