ZHCSAL3R December   2005  – April 2017 TPS74401

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable, Shutdown
      2. 7.3.2 Power-Good (VQFN Package Only)
      3. 7.3.3 Internal Current Limit
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
    5. 7.5 Programming
      1. 7.5.1 Programmable Soft-Start
      2. 7.5.2 Sequencing Requirements
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input, Output, and Bias Capacitor Requirements
      2. 8.1.2 Transient Response
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Output Noise
    2. 8.2 Typical Applications
      1. 8.2.1 Setting the TPS74401
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Using an Auxiliary Bias Rail
      3. 8.2.3 Without an Auxiliary Bias
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
        2. 11.1.1.2 Spice 模型
    2. 11.2 文档支持
      1. 11.2.1 相关文档　
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from Q Revision (April 2015) to R Revision

  • Added 在文档中增加了 RGR 封装Go
  • Changed 通篇将 TPS744xx 更改为 TPS74401Go
  • Changed 封装 特性 要点 Go
  • Changed 对 说明 部分的第二段进行了更改：增加了 RGR 封装，更改了第二句到最后一句Go
  • Deleted 典型应用电路方框图的固定电压版本Go
  • Added RGR package to Pin Configuration and Functions section Go
  • Changed FB/SNS to FB in both pin out drawings, deleted TPS744xx from VQFN package Go
  • Changed Surface Mount to Top View in KTW pin out drawingGo
  • Changed input capacitor to bias capacitor in BIAS pin description Go
  • Deleted (adjustable version only) from description of FB pin in Pin Functions table Go
  • Changed I/O column value to — from O for NC pins of Pin Functions table Go
  • Deleted SNS pin from Pin Functions table Go
  • Added RGR package to Thermal Information table Go
  • Deleted (adjustable version) from VREF parameter name in Electrical Characteristics table Go
  • Deleted SNS pin reference from IFB, ISNS parameter: changed symbol from IFB, ISNS to IFB, deleted sense from parameter nameGo
  • Deleted adjustable from footnote 1 and deleted ISNS from footnote 4 of Electrical Characteristics table Go
  • Changed conditions of R1, R2 in Noise Spectral Density figureGo
  • Deleted Fixed Voltage Versions figure from Functional Block Diagram sectionGo
  • Changed first paragraph of Application Information section: deleted and tracking capabilities from first sentence and changed very low input and output voltages to very low output voltages with low VIN to VOUT headroom in last sentenceGo
  • Changed title of first typical application from Adjustable Voltage Part and Setting to Setting the TPS74401Go
  • Deleted reference to adjustable version in first sentence and Typical Application Circuit for the TPS74401 figure in first typical application sectionGo
  • Changed Because VIN ≥ VOUT + 1.62 V to Because VIN is less than VOUT plus the VBIAS dropout and VBIAS = VIN to VBIAS = VOUT in last paragraph of Detailed Design Procedure in first typical application sectionGo
  • Deleted Fixed Voltage and Sense Pin sectionGo
  • Deleted BIAS recommendation from Layout Guidelines sectionGo
  • Changed RGW Package to VQFN Packages in caption of Layout Schematic figureGo
  • Added RGR package to VQFN description in Power Dissipation sectionGo
  • Added RGR package to Thermal Considerations section Go

Changes from P Revision (January 2015) to Q Revision

  • 通篇将 QFN 更改为 VQFNGo
  • 通篇将 TPS744xx 更改为 TPS74401 Go
  • 删除了固定输出电压 特性 要点Go
  • Changed VBIAS minimum value in Recommended Operating Conditions tableGo
  • Changed footnote 1 for Recommended Operating Conditions tableGo
  • Added second row to VOUT accuracy parameter Go
  • Added last four rows to VDO, VBIAS dropout voltage parameterGo
  • Added Timing Requirements tableGo
  • Added Device Functional Modes sectionGo
  • Changed third paragraph of Dropout VoltageGo
  • Changed first sentence of Without an Auxiliary Bias sectionGo
  • Changed Power Dissipation section location; moved to after Layout Example sectionGo
  • Added 开发支持 部分Go
  • Added 相关文档部分增加了有关参考设计 TIDU421 和用户指南 SLVU143 的信息Go

Changes from O Revision (March 2013) to P Revision

  • Deleted 特性列表中的高电平有效使能项目Go
  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed footnote 3c for Thermal Information table Go
  • Changed y-axis in Figure 1, Figure 2, Figure 4, and Figure 7 from abbreviation (IOUT) to text (Output Current) Go
  • Added "V" to VIN = 1.8 V condition in Figure 9, Figure 10, and Figure 11 Go
  • y-axis and graph title in Figure 15 from abbreviation (IOUT) to text (Output Current) Go
  • Changed Figure 25; made VOUT trace red to show data trend separation Go
  • Changed Overview section textGo
  • Changed second paragraph of Dropout Voltage Go
  • Changed Figure 27; updated equation in figure Go

Changes from N Revision (December 2012) to O Revision

  • Changed RGW and KTW values in Thermal Information tableGo

Changes from M Revision (November 2010) to N Revision

  • Changed TJ max value from 125 to 150 in Absolute Maximum Ratings tableGo

Changes from L Revision (August, 2010) to M Revision

Changes from K Revision (December, 2009) to L Revision

  • Replaced the Dissipation Ratings table with the Thermal Information tableGo
  • Revised Layout Recommendations and Power Dissipation sectionGo
  • Revised Thermal Considerations sectionGo
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