ZHCSC00C December   2013  – September 2024 UCC27532-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. 说明(续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VDD Undervoltage Lockout
      2. 7.3.2 Input Stage
      3. 7.3.3 Enable Function
      4. 7.3.4 Output Stage
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Driving IGBT Without Negative Bias
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Input-to-Output Configuration
          2. 8.2.1.2.2 Input Threshold Type
          3. 8.2.1.2.3 VDD Bias Supply Voltage
          4. 8.2.1.2.4 Peak Source and Sink Currents
          5. 8.2.1.2.5 Enable and Disable Function
          6. 8.2.1.2.6 Propagation Delay
          7. 8.2.1.2.7 Power Dissipation
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Driving IGBT With 13-V Negative Turnoff Bias
      3. 8.2.3 Using UCC27532-Q1 Drivers in an Inverter
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
  12. 11Device and Documentation Support
    1. 11.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

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Output Stage

Figure 7-2 shows the output stage of the UCC27532-Q1 device. The UCC27532-Q1 device features a unique architecture on the output stage which delivers the highest peak-source current when it is most needed during the Miller plateau region of the power switch turnon transition (when the power switch drain or collector voltage experiences dV/dt). The device output stage features a hybrid pullup structure using a parallel arrangement of N-Channel and P-Channel MOSFET devices. By turning on the N-Channel MOSFET during a narrow instant when the output changes state from low to high, the gate driver device is able to deliver a brief boost in the peak sourcing current enabling fast turnon.

UCC27532-Q1 UCC27532-Q1 Gate-Driver Output StageFigure 7-2 UCC27532-Q1 Gate-Driver Output Stage

The ROH parameter (see Section 6.5) is a DC measurement and is representative of the on-resistance of the P-Channel device only because the N-Channel device is turned-on only during output change of state from low to high. Thus the effective resistance of the hybrid pullup stage is much lower than what is represented by ROH parameter. The pulldown structure is composed of a N-Channel MOSFET only. The ROL parameter (see Section 6.5), which is also a DC measurement, is representative of true impedance of the pulldown stage in the device. In UCC27532-Q1 device, the effective resistance of the hybrid pullup structure is approximately 3 × ROL.

The UCC27532-Q1 device is capable of delivering 2.5-A source, 5-A Sink (asymmetrical drive) at VDD = 18 V. Strong sink capability in asymmetrical drive results in a very low pulldown impedance in the driver output stage which boosts immunity against the parasitic Miller turnon (high slew-rate dV/dt turnon) effect that is seen in both IGBT and FET power switches.

An example of a situation where Miller turnon is a concern is synchronous rectification (SR). In SR application, the dV/dt occurs on MOSFET drain when the MOSFET is already held in the off state by the gate driver. The current charging the CGD Miller capacitance during this high dV/dt is shunted by the pulldown stage of the driver. If the pulldown impedance is not low enough then a voltage spike can result in the VGS of the MOSFET, which can result in spurious turnon. This phenomenon is illustrated in Figure 7-3.

UCC27532-Q1 Low Pulldown Impedance in the UCC27532-Q1 Device  (Output Stage Mitigates Miller Turnon Effect)Figure 7-3 Low Pulldown Impedance in the UCC27532-Q1 Device (Output Stage Mitigates Miller Turnon Effect)

The driver output voltage swings between VDD and GND providing rail-to-rail operation because of the MOS output stage which delivers very low dropout. The presence of the MOSFET body diodes also offers low impedance to switching overshoots and undershoots which means that in many cases, external Schottky diode clamps can be eliminated.