可提供此米6体育平台手机版_好二三四的更新版本
功能与比较器件相同,但引脚排列有所不同
LM3485-Q1
- Easy-to-Use Control Methodology
- No Control-Loop Compensation Required
- 4.5-V to 35-V Wide Input Range
- 1.242-V to VIN Adjustable Output Range
- High Efficiency 93%
- ±1.3% (±2% Over Temp) Internal Reference
- 100% Duty Cycle
- Maximum Operating Frequency > 1 MHz
- Current Limit Protection
The LM3485 is a high-efficiency PFET switching regulator controller that can be used to quickly and easily develop a small, low-cost, switching buck regulator for a wide range of applications. The hysteretic control architecture provides for simple design without any control-loop stability concerns using a wide variety of external components. The PFET architecture also allows for low component count as well as ultralow dropout, 100% duty cycle operation. Another benefit is high efficiency operation at light loads without an increase in output ripple.
Current limit protection is provided by measuring the voltage across the RDS(ON) of the PFET, thus eliminating the need for a sense resistor. The cycle-by-cycle current limit can be adjusted with a single resistor, ensuring safe operation over a range of output currents.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | LM3485 Hysteretic PFET Buck Controller 数据表 (Rev. H) | PDF | HTML | 2015年 12月 28日 | ||
EVM 用户指南 | AN-1227 LM3485 Evaluation Board (Rev. B) | 2013年 4月 25日 | ||||
EVM 用户指南 | AN-1392 LM3485 LED Demo Board (Rev. B) | 2013年 4月 25日 | ||||
应用手册 | Application Note 1392 LM3485 LED Demo Board (cn) | 2006年 6月 7日 |
设计和开发
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LM3485LED-EVAL — 滞后 PFET 降压控制器
The LM3485 LED driver board is a buck regulator derived controlled current source designed to drive high power, high brightness LEDs (HBLEDs) such as the Luxeon™ Emitter at dissipations of 1W to 5W. The board can accept an input voltage ranging from 5V to 30V and can control the output current (...)
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
VSSOP (DGK) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点