可提供此米6体育平台手机版_好二三四的更新版本
功能与比较器件相似
TPS8268120
- Wide VIN Range From 2.5V to 5.5V
- Total Solution Size < 6.7 mm2
- Sub 1-mm Profile Solution
- ±1.5% DC Voltage Accuracy
- Up to 1600-mA Load Current
- Up to 90% Efficiency
- Fixed Output Voltage:
- TPS8268180: 1.80V
- TPS8268150: 1.50V
- TPS8268120: 1.20V
- TPS8268105: 1.05V
- TPS8268090: 0.90V
- Low EMI by Spread Spectrum PWM Frequency
Dithering - Best in Class Load and Line Transient Response
- Internal Soft Start
- Current Overload and Thermal Shutdown Protection
The TPS8268x device is a complete DC/DC step-down power supply optimized for small solution size. Included in the package are the switching regulator, inductor and input/output capacitors. Integration of all passive components enables a tiny solution size of only 6.7mm2.
The TPS8268x is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications in which high load currents in a very small solution size and height are required. The TPS8268x is optimized for high efficiency and low output voltage ripple and supports up to 1600-mA load current. With an input voltage range of 2.5-V to 5.5-V, the device supports applications powered by Li-Ion batteries as well as 5-V and 3.3-V rails.
The TPS8268x operates at a 5.5-MHz switching frequency with spread spectrum capability. For noise-sensitive applications, this provides a lower noise regulated output, as well as low noise at the input. The device supports a fixed output voltage, requiring no external feedback network.
These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency with the same size.
The TPS8268x is packaged in a compact (2.3mm × 2.9mm) and low profile BGA package suitable for automated assembly by standard surface mount equipment.
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技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TPS8268x 1600-mA High-Efficiency MicroSiP Step-Down Converter Module (Profile < 1.0mm) 数据表 (Rev. C) | PDF | HTML | 2015年 6月 22日 | ||
用户指南 | Manufacturing and Rework Design Guide for MicroSiP™ Power Modules (Rev. A) | PDF | HTML | 2021年 6月 16日 | |||
模拟设计期刊 | Understanding 100% mode in low-power DC/DC converters | 2018年 6月 22日 | ||||
模拟设计期刊 | Testing tips for applying external power to supply outputs without an input voltage | 2016年 10月 24日 | ||||
白皮书 | SiP Power Modules White Paper | 2016年 1月 26日 | ||||
EVM 用户指南 | TPS82681xxEVM-589 User’s Guide (Rev. A) | 2015年 7月 7日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
USIP (SIP) | 9 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点