Product details

Technology family CD4000 Function Digital Multiplexer Configuration 8:1 Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog
Technology family CD4000 Function Digital Multiplexer Configuration 8:1 Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8 TSSOP (PW) 16 32 mm² 5 x 6.4
  • 3-state output
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
            1 V at VDD = 5 V
            2 V at VDD = 10 V
         2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Applications:
    • Digital multiplexing
    • Number-sequence generation
    • Signal gating

Data sheet acquired from Harris Semiconductor

  • 3-state output
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
            1 V at VDD = 5 V
            2 V at VDD = 10 V
         2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Applications:
    • Digital multiplexing
    • Number-sequence generation
    • Signal gating

Data sheet acquired from Harris Semiconductor

CD4512B is an 8-channel data selector featuring a three-state output that can interface directly with, and drive, data lines of bus-oriented systems.

The CD4512B-series types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4512B is an 8-channel data selector featuring a three-state output that can interface directly with, and drive, data lines of bus-oriented systems.

The CD4512B-series types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

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Technical documentation

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Type Title Date
* Data sheet CD4512B TYPES datasheet (Rev. C) 13 Oct 2003
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 03 Dec 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Package Pins CAD symbols, footprints & 3D models
PDIP (N) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
SOP (NS) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

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