TMAG5170
- High-precision linear 3D Hall-effect sensor to optimize position sensing speed and accuracy:
- Linear measurement total error: ±2.6% (maximum at 25°C)
- Sensitivity temperature drift: ±2.8% (maximum)
- 20-Ksps conversion rate for single axis
- 10-MHz serial peripheral interface (SPI) with cyclic redundancy check (CRC)
- Built-in temperature sensor with < ±2°C error
- Independently selectable X, Y, and Z magnetic ranges:
- TMAG5170A1: ±25, ±50, ±100 mT
- TMAG5170A2: ±75, ±150, ±300 mT
- 5-nA (typical) deep sleep mode current
- Autonomous wake-up and sleep mode for threshold detection consuming only 1.5 µA
- ALERT function to initiate sensor conversion or indicate conversion complete
- Integrated diagnostics for fault detection
- Integrated angle CORDIC calculation with gain and offset adjustment
- 2.3-V to 5.5-V supply voltage range
- Operating temperature range: –40°C to +150°C
The TMAG5170 is a high-precision linear 3D Hall-effect sensor designed for a wide range of industrial and personal electronics applications. The high level of integration offers flexibility and accuracy in a variety of position sensing systems. This device features 3 independent Hall sensors at X, Y, and Z axes.
A precision signal-chain along with an integrated 12-bit ADC enables high accuracy and low drift magnetic field measurements while supporting a sampling of up to 20 ksps. On-chip temperature sensor data is available for system-level drift compensation.
Integrated angle calculation engine (CORDIC) provides full 360° angular position information for both on-axis and off-axis angle measurement topologies. The angle calculation is performed using two user-selected magnetic axes. The device features magnetic gain and offset correction to mitigate the impact of system mechanical error sources.
The TMAG5170 can be configured through the SPI to enable any combination of magnetic axes and temperature measurements. Multiple sensor conversion schemes and SPI read frames help optimize throughput and accuracy. A dedicated ALERT pin can act as a system interrupt during low power wake-up and sleep mode, and can also be used by a microcontroller to trigger a new sensor conversion.
The TMAG5170 offers multiple diagnostics features to detect and report both system and device-level failures. The SPI communication features a user-enabled cyclic redundancy check to enhance the data integrity.
The device is offered in two different orderables to support wide magnetic fields ranges from ±25mT to ±300mT.
The device performs consistently across a wide ambient temperature range of –40°C to +150°C.
TMAG5170 won second in Elektronik’s Product of the Year Measurement & Sensing category.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
TMAG5170UEVM — TMAG5170 evaluation module for high-precision, linear 3D Hall-effect sensor with SPI bus interface
HALL-PROXIMITY-DESIGN — Magnetic Sensing Proximity Tool
HALL-PROXIMITY-DESIGN is a software tool that facilitates rapid iterative design for magnet and Hall-effect sensor systems.
Supported products & hardware
Products
Multi-axis linear & angle position sensors
Linear Hall-effect sensors
Hall-effect latches & switches
Hardware development
Evaluation board
Software
Calculation tool
SBAR012 — Angle Error Calculator for Linear 3D Hall-effect Sensors
Supported products & hardware
Products
Multi-axis linear & angle position sensors
TI-MAGNETIC-SENSE-SIMULATOR — TI Magnetic sensing simulation tool
Supported products & hardware
Products
Hall-effect latches & switches
Linear Hall-effect sensors
Multi-axis linear & angle position sensors
Hardware development
Evaluation board
Software
Calculation tool
TIDA-060045 — Accurate low-latency linear position sense reference design with quad 3D Hall-effect sensors
TIDA-060040 — Absolute angle encoder reference design with Hall-effect sensors for precise motor position control
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
VSSOP (DGK) | 8 | Ultra Librarian |
Ordering & quality
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- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
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- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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