TPSI31P1-Q1
- Replaces large, high power pre-charge resistors using a switched converter architecture
- Improved thermal performance compared to passive pre-charge solutions
- Hysteretic current control for linear charging of downstream capacitance
- Drives external power transistors such as Si, SiC MOSFET, or IGBT
- Integrated isolated secondary supply for gate bias
- 17V gate drive, 1.5A and 2.5A peak source and sink current
- AEC Q-100 qualified for automotive applications:
- Temperature grade 1: –40°C to +125°C, TA
- Functional Safety-Capable
- Safety-related certifications
- Planned: 7070VPK reinforced isolation per DIN EN IEC 60747-17 (VDE 0884-17)
- Planned: 5kVRMS isolation for 1 minute per UL 1577
The TPSI31P1-Q1 is designed to be used in automotive pre-charge systems as an alternative to traditional passive pre-charge architectures that typically include costly electromechanical relays (EMR), along with bulky, high power resistors. The TPSI31P1-Q1, combined with external power switches, power inductor and diode, forms an active pre-charge solution. The inductor current is continuously monitored and controlled in a hysteretic mode of operation by the TPSI31P1-Q1 to linearly charge the large capacitance of the downstream system. The TPSI31P1-Q1 is an isolated switch driver that generates its own secondary bias supply from power received on its primary side, therefore no isolated secondary supply is required. With a gate drive voltage of 17V with 1.5A and 2.5A peak source and sink current, a large availability of power switches can be used including SiC FET and IGBT.
The TPSI31P1-Q1 integrates a communication back-channel that transfers status information from the secondary side to the primary side via open-drain output, PGOOD (Power Good) and indicates when the secondary power is valid.
The TPSI31P1-Q1 reinforced isolation is extremely robust with much higher reliability, lower power consumption, and increased temperature ranges than those found in optocouplers. Replacing the EMR and power resistor with a solid state solution can lead to reduced cost and form factor, while providing higher reliability.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
TPSI31PXQ1EVM — TPSI31Px-Q1 evaluation module
The TPSI31Px-Q1 evaluation module (EVM) helps designers evaluate the operation and performance of TPSI31P1-Q1 in an electric vehicle (EV) or hybrid electric vehicle (HEV) high-side active precharge application for charging a DC-link capacitor.
- TPSI31PXQ1EVM: 800VDC with 10AAVG
- TPSI31PXQ1EVM-400: (...)
PSPICE-FOR-TI — PSpice® for TI design and simulation tool
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
SO-MOD (DVX) | 16 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.