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TPSM8287A15

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6V input, 15A parallelable DC/DC buck module with I2C frequency synchronization and remote sense

Product details

Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Step-Down Converter, Synchronous Buck Type Converter (Integrated Switch), Module Iout (max) (A) 15 Vin (min) (V) 2.7 Vin (max) (V) 6, 6 Vout (min) (V) 0.45 Vout (max) (V) 3.35 Switching frequency (min) (kHz) 1300 Switching frequency (max) (kHz) 2700 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features Adjustable soft start, Current Sharing, Differential Remote Sense, Differential Voltage sensing, EMI Tested, Enable, Frequency Dithering, Frequency synchronization, I2C control, I2C interface, I2C support, I2C/PMBus, Light Load Efficiency, Multiphase, Output discharge, Overcurrent protection, Phase Interleaving, Power good, Remote Sense, Remote Sensing, Spread-spectrum frequency dithering Control mode COT, Constant on-time (COT) Duty cycle (max) (%) 75
Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Step-Down Converter, Synchronous Buck Type Converter (Integrated Switch), Module Iout (max) (A) 15 Vin (min) (V) 2.7 Vin (max) (V) 6, 6 Vout (min) (V) 0.45 Vout (max) (V) 3.35 Switching frequency (min) (kHz) 1300 Switching frequency (max) (kHz) 2700 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features Adjustable soft start, Current Sharing, Differential Remote Sense, Differential Voltage sensing, EMI Tested, Enable, Frequency Dithering, Frequency synchronization, I2C control, I2C interface, I2C support, I2C/PMBus, Light Load Efficiency, Multiphase, Output discharge, Overcurrent protection, Phase Interleaving, Power good, Remote Sense, Remote Sensing, Spread-spectrum frequency dithering Control mode COT, Constant on-time (COT) Duty cycle (max) (%) 75
B3QFN (RDW) 39 30.6 mm² 4.5 x 6.8
  • ±0.8% output voltage accuracy
  • Differential remote sensing
  • Parallelable for multi-phase operation
  • Start-up output voltage selectable in 50mV steps from 0.40V to 3.35V through VSETx pins and I2C adjustable in 1.25mV steps
  • 5 selectable I2C addresses through VSETx pins
  • Adjustable external compensation for wide output capacitor range and optimized transient response
  • Optimized for low EMI requirements
    • No bond wire package
    • Internal input capacitors
    • Simplified layout through parallel input path
    • Optional synchronization to external clock or spread-spectrum operation
  • Power-save mode or forced-PWM operation
  • Precise enable input threshold
  • Power-good output with window comparator
  • Active output discharge
  • Excellent thermal performance
  • –40°C to 125°C operating temperature range
  • 4.5mm × 6.8mm QFN package with 0.5mm pitch
  • 77mm2 solution size
  • ±0.8% output voltage accuracy
  • Differential remote sensing
  • Parallelable for multi-phase operation
  • Start-up output voltage selectable in 50mV steps from 0.40V to 3.35V through VSETx pins and I2C adjustable in 1.25mV steps
  • 5 selectable I2C addresses through VSETx pins
  • Adjustable external compensation for wide output capacitor range and optimized transient response
  • Optimized for low EMI requirements
    • No bond wire package
    • Internal input capacitors
    • Simplified layout through parallel input path
    • Optional synchronization to external clock or spread-spectrum operation
  • Power-save mode or forced-PWM operation
  • Precise enable input threshold
  • Power-good output with window comparator
  • Active output discharge
  • Excellent thermal performance
  • –40°C to 125°C operating temperature range
  • 4.5mm × 6.8mm QFN package with 0.5mm pitch
  • 77mm2 solution size

The TPSM8287Axx is a family of pin-to-pin step-down DC/DC power modules with differential remote sensing and I2C interface. The power modules integrate a synchronous step-down converter, an inductor and input capacitors to simplify design, reduce external components and save PCB area. The low-profile and compact design is designed for assembly by standard surface mount equipment. The TPSM8287Axx family implements an enhanced control scheme that supports fast transients. The TPSM8287Axx can operate in fixed-frequency or power-save mode. The remote sensing feature optimizes voltage regulation at the point-of-load and the device achieves ±0.8% DC voltage accuracy over the entire temperature range. The devices can operate in stacked, paralleled mode to deliver higher output currents or to spread the power dissipation across multiple devices. The I2C-compatible interface offers several control, monitoring and warning features. The start-up voltage is selectable through the VSETx pins to allow a power-up without an active I2C communication.

The TPSM8287Axx is a family of pin-to-pin step-down DC/DC power modules with differential remote sensing and I2C interface. The power modules integrate a synchronous step-down converter, an inductor and input capacitors to simplify design, reduce external components and save PCB area. The low-profile and compact design is designed for assembly by standard surface mount equipment. The TPSM8287Axx family implements an enhanced control scheme that supports fast transients. The TPSM8287Axx can operate in fixed-frequency or power-save mode. The remote sensing feature optimizes voltage regulation at the point-of-load and the device achieves ±0.8% DC voltage accuracy over the entire temperature range. The devices can operate in stacked, paralleled mode to deliver higher output currents or to spread the power dissipation across multiple devices. The I2C-compatible interface offers several control, monitoring and warning features. The start-up voltage is selectable through the VSETx pins to allow a power-up without an active I2C communication.

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Technical documentation

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* Data sheet TPSM8287Axx 2.7V to 6V Input, 6A, 10A, 12A, and 15A, Parallelable Step-Down Power Module With I2 C Interface and Remote Sense datasheet (Rev. D) PDF | HTML 06 Jun 2024
EVM User's guide Parallelable, I2C, Remote Sense 6-A, 12-A Power Module Evaluation Module (Rev. B) PDF | HTML 16 Apr 2024
Analog Design Journal 固定頻率 DCS-Control:具有時脈同步的快速瞬態回應 PDF | HTML 13 Feb 2024
Analog Design Journal 고정 주파수 DCS 제어: 클록 동기화를 통한 빠른 과도 응답 PDF | HTML 13 Feb 2024
Analog Design Journal Fixed-frequency DCS-Control: Fast transient response with clock synchronization PDF | HTML 12 Feb 2024
Certificate TPSM8287A15BBHEVM EU Declaration of Conformity (DoC) 02 Jan 2024
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 06 Dec 2023
Application note Benefiting from Step-Down Converters with an I2C Communication Interface (Rev. B) PDF | HTML 29 Nov 2023
Application note AM68x Processor Power Solutions Using LP87334E PMIC for Industrial Applications PDF | HTML 14 Mar 2023
Application note Using the Filters with the DC/DC Step-Down Converter PDF | HTML 02 Feb 2023
Application note Operating TPS6287X-Q1 Devices in a Stacked Configuration PDF | HTML 30 Jan 2023
Application note Adjusting the Output Voltage of a Fixed Output Voltage DC-DC Converter PDF | HTML 22 Dec 2022
Application note Intro to Multi-Function Pins and Their Applications in TI Step-Down Converters (Rev. A) PDF | HTML 17 Nov 2022
Application note Understanding SOA Curves to Operate at High Output Currents and Temperature PDF | HTML 05 May 2022
Application note How to Measure Impedance of a Power Distribution Network of a DC-DC Converter PDF | HTML 20 Jan 2022
Application note Loop Gain Reconstruction of a Step-Down Converter from Output Impedance PDF | HTML 20 Jan 2022
White paper Enabling Higher Data Rates for Optical Modules With Small and Efficient Power 22 Mar 2021
White paper Benefits of a Resistor-to-Digital Converter in Ultra-Low Power Supplies 14 Oct 2019
Analog Design Journal Methods of output-voltage adjustment for DC/DC converters 14 Jun 2019
Analog Design Journal Achieving a clean startup by using a DC/DC converter with a precise enable-pin threshold 24 Oct 2017
Analog Design Journal Understanding frequency variation in the DCS-Control(TM) topology 30 Oct 2015
Application note Basic Calculation of a Buck Converter's Power Stage (Rev. B) 17 Aug 2015
Analog Design Journal High-efficiency, low-ripple DCS-Control offers seamless PWM/pwr-save transitions 25 Jul 2013
Application note Choosing an Appropriate Pull-up/Pull-down Resistor for Open Drain Outputs 19 Sep 2011

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TPSM8287A06BASEVM — TPSM8287A06 evaluation module for parallelable, I²C interface, remote sense 6A step-down mod

The TPSM8287A06BAS evaluation module (EVM) facilitates the evaluation of the TPSM8287A06, a 6A pin-to-pin compatible step-down power module with an I²C interface, remote sense and frequency synchronization in a 4.5mm × 6.8mm x 1.8mm overmolded quad flatpack no-lead (QFN) package. The EVM (...)

User guide: PDF | HTML
Not available on TI.com
Evaluation board

TPSM8287A10BAHEVM — TPSM8287A10 evaluation module

The TPSM8287A10 evaluation module (EVM) facilitates the evaluation of the TPSM8287A10, which supports up to 10A load current in a pin-to-pin compatible step-down power module with an I2C interface, remote sense and frequency synchronization in a 4.5mm by 6.8mm over molded QFN package. The EVM (...)
User guide: PDF | HTML
Not available on TI.com
Evaluation board

TPSM8287A12BBSEVM — TPSM8287A12 evaluation module for parallelable I²C interface with remote sense 12-A step-down module

The TPSM8287A12BBSEVM evaluation module (EVM) facilitates the evaluation of the TPSM8287A12, a 12 A pin-to-pin compatible step-down power module with an I²C interface, remote sense and frequency synchronization in a 4.5 mm × 6.8 mm x 1.8 mm overmolded QFN package. The EVM provides an (...)
User guide: PDF | HTML
Not available on TI.com
Evaluation board

TPSM8287A15BBHEVM — TPSM8287A15 evaluation module

The TPSM8287A15BBHEVM evaluation module (EVM) facilitates the evaluation of the TPSM8287A15, a 15A pin-to-pin compatible step-down power module with an I²C interface, remote sense, and frequency synchronization in a 4.5mm × 6.8mm x 4mm overmolded QFN package. The EVM provides an adjustable output (...)

User guide: PDF | HTML
Not available on TI.com
GUI for evaluation module (EVM)

TPSM8287A-EVM-GUI TPSM8287A EVM GUI

The TPSM8287A EVM GUI interfaces with the TPSM8287Axx EVMs via the USB2ANY adaptor to read and write to the device's I2C registers.
Supported products & hardware

Supported products & hardware

Products
Power modules (integrated inductor)
TPSM8287A06 6-V Input, 6-A parallelable DC-DC buck module with I2C, frequency synch and remote sense TPSM8287A10 6V input, 10A parallelable DC/DC buck module with I2C frequency synchronization and remote sense TPSM8287A12 6-V input, 12-A stackable DC-DC buck module with I2C and integrated inductor TPSM8287A15 6V input, 15A parallelable DC/DC buck module with I2C frequency synchronization and remote sense
Hardware development
Evaluation board
TPSM8287A06BASEVM TPSM8287A06 evaluation module for parallelable, I²C interface, remote sense 6A step-down mod TPSM8287A12BBSEVM TPSM8287A12 evaluation module for parallelable I²C interface with remote sense 12-A step-down module TPSM8287A10BAHEVM TPSM8287A10 evaluation module TPSM8287A15BBHEVM TPSM8287A15 evaluation module
Calculation tool

TPSM8287A-COMPONENT-CALCULATOR TPSM8287A component calculator

TPSM8287A Component Calculator
Supported products & hardware

Supported products & hardware

Products
Power modules (integrated inductor)
TPSM8287A06 6-V Input, 6-A parallelable DC-DC buck module with I2C, frequency synch and remote sense TPSM8287A10 6V input, 10A parallelable DC/DC buck module with I2C frequency synchronization and remote sense TPSM8287A12 6-V input, 12-A stackable DC-DC buck module with I2C and integrated inductor TPSM8287A15 6V input, 15A parallelable DC/DC buck module with I2C frequency synchronization and remote sense
Gerber file

TPSM8287A12BBSEVM Gerber Files

SLVC851.ZIP (850 KB)
Package Pins CAD symbols, footprints & 3D models
B3QFN (RDW) 39 Ultra Librarian

Ordering & quality

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  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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