LP2998-Q1

正在供货

用于汽车应用的 DDR 终端稳压器

米6体育平台手机版_好二三四详情

Vin (min) (V) 1.35 Vin (max) (V) 5.5 Vout (min) (V) 0.656 Vout (max) (V) 0.698 Features Shutdown Pin for S3 Iq (typ) (mA) 0.32 Rating Automotive Operating temperature range (°C) -40 to 125 Product type DDR DDR memory type DDR, DDR2, DDR3, DDR3L
Vin (min) (V) 1.35 Vin (max) (V) 5.5 Vout (min) (V) 0.656 Vout (max) (V) 0.698 Features Shutdown Pin for S3 Iq (typ) (mA) 0.32 Rating Automotive Operating temperature range (°C) -40 to 125 Product type DDR DDR memory type DDR, DDR2, DDR3, DDR3L
HSOIC (DDA) 8 29.4 mm² 4.9 x 6
  • AEC-Q100 Test Guidance with the following results
    (SO PowerPAD-8):
    • Device HBM ESD Classification Level H1C
    • Junction Temperature Range –40°C to 125°C
  • 1.35 V Minimum VDDQ
  • Source and Sink Current
  • Low Output Voltage Offset
  • No External Resistors Required
  • Linear Topology
  • Suspend to Ram (STR) Functionality
  • Low External Component Count
  • Thermal Shutdown
  • AEC-Q100 Test Guidance with the following results
    (SO PowerPAD-8):
    • Device HBM ESD Classification Level H1C
    • Junction Temperature Range –40°C to 125°C
  • 1.35 V Minimum VDDQ
  • Source and Sink Current
  • Low Output Voltage Offset
  • No External Resistors Required
  • Linear Topology
  • Suspend to Ram (STR) Functionality
  • Low External Component Count
  • Thermal Shutdown

The LP2998 linear regulator is designed to meet JEDEC SSTL-2 and JEDEC SSTL-18 specifications for termination of DDR-SDRAM and DDR2 memory. The device also supports DDR3 and DDR3L VTT bus termination with VDDQ min of 1.35 V. The device contains a high-speed operational amplifier to provide excellent response to load transients. The output stage prevents shoot through while delivering 1.5 A continuous current and transient peaks up to 3 A in the application as required for DDR-SDRAM termination. The LP2998 also incorporates a VSENSE pin to provide superior load regulation and a VREF output as a reference for the chipset and DIMMs.

An additional feature found on the LP2998 is an active low shutdown (SD) pin that provides Suspend To RAM (STR) functionality. When SD is pulled low the VTT output will tri-state providing a high impedance output, but, VREF will remain active. A power savings advantage can be obtained in this mode through lower quiescent current.

The LP2998 linear regulator is designed to meet JEDEC SSTL-2 and JEDEC SSTL-18 specifications for termination of DDR-SDRAM and DDR2 memory. The device also supports DDR3 and DDR3L VTT bus termination with VDDQ min of 1.35 V. The device contains a high-speed operational amplifier to provide excellent response to load transients. The output stage prevents shoot through while delivering 1.5 A continuous current and transient peaks up to 3 A in the application as required for DDR-SDRAM termination. The LP2998 also incorporates a VSENSE pin to provide superior load regulation and a VREF output as a reference for the chipset and DIMMs.

An additional feature found on the LP2998 is an active low shutdown (SD) pin that provides Suspend To RAM (STR) functionality. When SD is pulled low the VTT output will tri-state providing a high impedance output, but, VREF will remain active. A power savings advantage can be obtained in this mode through lower quiescent current.

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类型 标题 下载最新的英语版本 日期
* 数据表 LP2998/LP2998-Q1 DDR Termination Regulator 数据表 (Rev. K) PDF | HTML 2014年 8月 20日
EVM 用户指南 AN-1813 LP2998 Evaluation Board (Rev. A) 2013年 5月 7日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

LP2998EVAL — 用于 LP2998 的评估板

The LP2998 evaluation board is designed to provide the design Engineer with a fully functional prototype system in which to evaluate the LP2998 in both a static environment and with a complete memory system.

用户指南: PDF
TI.com 上无现货
参考设计

TIDA-00275 — 汽车仪表板宽输入电压电源设计

此 TI 参考设计是一种汽车仪表盘宽电压输入电源解决方案,包含一个带有集成 LDO 的宽电压输入降压转换器。  还包含一个高效率同步降压直流/直流转换器。另外还包含一个线性稳压器,旨在使 DDR 终端符合 JEDEC SSTL-2 和 JEDEC SSTL-18 规格。此仪表盘电源解决方案已针对中端仪表盘市场进行优化,整个解决方案支持 6.0V-40V 系统功能,可承受启动停止和负载突降情况。前端降压转换器 (TPS65320-Q1) 能够支持 4.5V 冷启动情况。
测试报告: PDF
原理图: PDF
封装 引脚 CAD 符号、封装和 3D 模型
HSOIC (DDA) 8 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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