SM72482
- Renewable Energy Grade
- Independently Drives Two N-Channel MOSFETs
- Compound CMOS and Bipolar Outputs Reduce Output Current Variation
- 5A Sink, 3A Source Current Capability
- Two Channels Can be Connected in Parallel to Double the Drive Current
- Independent Inputs (TTL Compatible)
- Fast Propagation Times (25 ns Typical)
- Fast Rise and Fall Times (14 ns Rise, 12 ns Fall With 2 nF Load)
- Available in Dual Noninverting, Dual Inverting, and Combination Configurations
- Supply Rail Under-Voltage Lockout Protection (UVLO)
- SM72482 UVLO Configured to Drive PFET Through OUT_A and NFET Through OUT_B
- Pin Compatible With Industry Standard Gate Drivers
- Packages
- SOIC
- Thermally Enhanced VSSOP
All trademarks are the property of their respective owners.
The SM72482 Dual Gate Driver replaces industry standard gate drivers with improved peak output current and efficiency. Each “compound” output driver stage includes MOS and bipolar transistors operating in parallel that together sink more than 5A peak from capacitive loads. Combining the unique characteristics of MOS and bipolar devices reduces drive current variation with voltage and temperature. Under-voltage lockout protection is also provided. The drivers can be operated in parallel with inputs and outputs connected to double the drive current capability. This device is available in the SOIC package.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | SM72482 Dual 5A Compound Gate Driver 数据表 (Rev. C) | 2013年 4月 1日 | |||
应用简报 | How to overcome negative voltage transients on low-side gate drivers' inputs | 2019年 1月 18日 | ||||
更多文献资料 | Fundamentals of MOSFET and IGBT Gate Driver Circuits (Replaces SLUP169) (Rev. A) | 2018年 10月 29日 | ||||
更多文献资料 | MOSFET 和 IGBT 栅极驱动器电路的基本原理 | 最新英语版本 (Rev.A) | 2018年 4月 17日 |
设计和开发
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PMP9461 — 适用于光伏微型逆变器直流/直流和直流/交流块的栅极驱动和辅助电源解决方案参考设计
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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