SNVS569C May   2009  – October 2016 LM3550

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 STROBE Pin
      2. 7.3.2 End-of-Charge Pin (EOC)
      3. 7.3.3 ALD/TEMP Pin
      4. 7.3.4 IND Pin
      5. 7.3.5 BAL Pin
      6. 7.3.6 Super-Capacitor Charging Time
      7. 7.3.7 Super-Capacitor Voltage Profile
      8. 7.3.8 Peak Flash Current
      9. 7.3.9 Maximum Flash Duration
    4. 7.4 Device Functional Modes
      1. 7.4.1 State Machine Description
        1. 7.4.1.1 Basic Description
        2. 7.4.1.2 Shutdown State
        3. 7.4.1.3 Torch State
        4. 7.4.1.4 Charge State
          1. 7.4.1.4.1 Fixed-Voltage-Charge Mode
          2. 7.4.1.4.2 Optimal Charge Mode
        5. 7.4.1.5 Torch and Charge State
        6. 7.4.1.6 Flash State
        7. 7.4.1.7 EOC Functionality
        8. 7.4.1.8 State Diagram FGATE = 1
        9. 7.4.1.9 Optimal Charge Mode vs Fixed Voltage Mode
          1. 7.4.1.9.1 Optimal Charge Mode vs Fixed Voltage Mode
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Child Address: 0x53
    6. 7.6 Register Maps
      1. 7.6.1 Internal Registers
        1. 7.6.1.1 General Purpose Register Description
        2. 7.6.1.2 Current Control Register Description
        3. 7.6.1.3 Options Control Register Description
        4. 7.6.1.4 ALD/TEMP Sense High/Low Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection
          1. 8.2.2.1.1 Super-Capacitor
          2. 8.2.2.1.2 Boost Capacitors
          3. 8.2.2.1.3 Current Source FET
          4. 8.2.2.1.4 ALD/TEMP Components
            1. 8.2.2.1.4.1 NTC Selection
            2. 8.2.2.1.4.2 Ambient Light Sensor
          5. 8.2.2.1.5 Thermal Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from B Revision (May 2013) to C Revision

  • Changed title from "5-A Flash LED Driver With Automatic VLED and ESR Detection for Mobile Camera Systems" to " 5-A Super-Capacitor Flash LED Driver"; add top nav icon for reference designGo
  • Added new Applications: delete 'camera phones" Go
  • Deleted redundant text from "Features" and "Description" so required content fits on page 1 Go
  • Added "controller or"Go
  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted footnotes 1, 3, 4 from ROC table rows - no longer necessary Go
  • Changed value for RθJA from "57°C/W" to "60.1°C/W"; add additional thermal valuesGo
  • Added "a controller"Go
  • Deleted "in the microcontroller/microprocessor."Go

Changes from A Revision (May 2013) to B Revision

  • Changed layout of National Semiconductor data sheet to TI formatGo
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