ZHCSSK2D October   2006  – October 2024 XTR111

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Dynamic Performance
      3. 6.3.3 External Current Limit
      4. 6.3.4 External MOSFET
      5. 6.3.5 Output Error Flag and Disable Input
      6. 6.3.6 Voltage Regulator
      7. 6.3.7 Level Shift of 0V Input and Transconductance Trim
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Error Flag Delay
      3. 7.1.3 Voltage Output Configuration
      4. 7.1.4 4mA-to-20mA Output
    2. 7.2 Typical Applications
      1. 7.2.1 0mA–20mA Voltage-to-Current Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package and Heat Dissipation
        2. 7.4.1.2 Thermal Pad Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision C (June 2011) to Revision D (October 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 添加了规格、ESD 等级、建议运行条件、热性能信息、详细说明、概述、功能方框图、特性说明、器件功能模式、应用和实现、典型应用、电源相关建议、布局、布局示例、器件和文档支持 和机械、封装和可订购信息 部分Go
  • 将说明 中的最大输出电流从 36mA 更改为 32mA。Go
  • Moved maximum current specification for IS from table note to table row.Go
  • Added charged device model (CDM) ESD specification of ±1000V to ESD Ratings.Go
  • Changed Specified output current (derated performance) maximum from 36mA to 32mA in Electrical Characteristics Go
  • Changed Current limit for output current from 42 ±6mA to 41 ±9mA in Electrical Characteristics Go
  • Changed Nonlinearity, IOUT/ISET test condition from "0.1mA to 36mA" to "0.1mA to 32mA" in Electrical Characteristics Go
  • Deleted redundant specified and operating temperature, specified and operating voltage, and package thermal impedance from Electrical Characteristics.Go
  • Changed maximum current specification from 36mA to 32mA in Overview.Go
  • Updated Table 6-1, P-Channel MOSFET (Examples) Go
  • Added Error Flag Delay section to Application Information Go
  • Changed from DAC7551 to DAC60501Go
  • Added Power Supply Recommendations Go
  • Added additional guidance on heat dissipation in Package and Heat Dissipation Go

Changes from Revision B (June, 2010) to Revision C (June, 2011)

  • Updated wiring error in Figure 46, Current Using a 0V to 5V Input From the DAC7551, a 12‑Bit Digital-to-Analog Converter Go

Changes from Revision A (August 2007) to Revision B (June 2010)
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