FDC2112-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1:–40°C to +125°C
Ambient Operating Temperature Range - Device HBM ESD Classification Level 2
- Device CDM ESD Classification Level C5
- Device Temperature Grade 1:–40°C to +125°C
- EMI-Resistant Architecture
- Maximum Output Rates (One Active Channel):
- 13.3 ksps (FDC2112-Q1, FDC2114-Q1)
- 4.08 ksps (FDC2212-Q1, FDC2214-Q1)
- Maximum Input Capacitance: 250 nF (at 10 kHz
with 1-mH inductor) - Sensor Excitation Frequency: 10 kHz to 10 MHz
- Number of Channels: 2, 4
- Resolution: Up to 28 bits
- RMS noise: 0.3 fF at 100 sps and fSENSOR = 5MHz
- Supply Voltage: 2.7 V to 3.6 V
- Power Consumption: Active: 2.1 mA
- Low-Power Sleep Mode: 35 µA
- Shutdown: 200 nA
- Interface: I2C
- Temperature Range: –40°C to +125°C
Capacitive sensing is a low-power, low-cost, high-resolution contactless sensing technique that can be applied to a variety of applications ranging from proximity detection to gesture recognition. The sensor in a capacitive sensing system is any metal or conductor, allowing for low cost and highly flexible system design.
The main challenge limiting sensitivity in capacitive sensing applications is noise susceptibility of the sensors. With the FDC2x1x-Q1 innovative EMI resistant architecture, performance can be maintained even in presence of high-noise environments.
The FDC2x1x-Q1 is a multi-channel family of noise- and EMI-resistant, high-resolution, high-speed capacitance-to-digital converters for implementing capacitive sensing solutions. The devices employ an innovative narrow-band based architecture to offer high rejection of noise and interferers while providing high resolution at high speed. The devices support a wide excitation frequency range, offering flexibility in system design.
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | FDC2112-Q1, FDC2114-Q1, FDC2212-Q1, FDC2214-Q1 Multi-Channel 12-Bit or 28-Bit Capacitance-to-Digital Converter (FDC) for Capacitive Sensing datasheet | PDF | HTML | 05 May 2016 |
Application note | Common Inductive and Capacitive Sensing Applications (Rev. B) | PDF | HTML | 22 Jun 2021 | |
Application note | Simulate Inductive Sensors Using FEMM (Finite Element Method Magnetics) (Rev. A) | PDF | HTML | 16 Jun 2021 | |
Application note | Capacitive Proximity Sensing Using FDC2x1y (Rev. A) | 20 Oct 2017 | ||
EVM User's guide | FDC2114 and FDC2214 EVM User’s Guide (Rev. A) | 14 Sep 2016 | ||
Application note | Ground Shifting in Capacitive Sensing Applications | PDF | HTML | 27 May 2016 | |
Application note | Power Consumption Analysis for Low Power Capacitive Sensing Applications | PDF | HTML | 18 Jan 2016 | |
Application note | Derivative Integration Algorithm for Proximity Sensing | 29 Sep 2015 | ||
Application note | Capacitive Sensing: Direct vs Remote Liquid Level Sensing Performance Analysis (Rev. A) | 24 Jul 2015 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
FDC2114EVM — FDC2114 with Two Capacitive Sensors Evaluation Module
SNOC033 — FDC211x/FDC221x Current Consumption Estimator
Supported products & hardware
Products
Signal conditioners
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
WSON (DNT) | 12 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.