TPS54319
- Two 45-m (typical) MOSFETs for High Efficiency at 3-A Loads
- 300kHz to 2MHz Switching Frequency
- 0.8 V ± 3.0% Voltage Reference Over Temperature (0°C to 85°C)
- Synchronizes to External Clock
- Adjustable Slow Start/Sequencing
- UV and OV Power Good Output
- –40°C to 150°C Operating Junction Temperature Range
- Thermally Enhanced 3mm × 3mm 16-pin QFN
- Pin Compatible to TPS54318
- APPLICATIONS
- Low-Voltage, High-Density Power Systems
- Point-of-Load Regulation for Consumer Applications such as Set Top Boxes,
LCD Displays, CPE Equipment
SWIFT, SwitcherPro are trademarks of Texas Instruments.
The TPS54319 device is a full featured 6 V, 3 A, synchronous step down current mode converter with two integrated MOSFETs.
The TPS54319 enables small designs by integrating the MOSFETs, implementing current mode control to reduce external component count, reducing inductor size by enabling up to 2 MHz switching frequency, and minimizing the IC footprint with a small 3mm × 3mm thermally enhanced QFN package.
The TPS54319 provides accurate regulation for a variety of loads with an accurate ±3.0% Voltage Reference (VREF) over temperature.
Efficiency is maximized through the integrated 45m MOSFETs and 360µA typical supply current. Using the enable pin, shutdown supply current is reduced to 2 µA by entering a shutdown mode.
Under voltage lockout is internally set at 2.6 V, but can be increased by programming the threshold with a resistor network on the enable pin. The output voltage startup ramp is controlled by the slow start pin. An open drain power good signal indicates the output is within 93% to 107% of its nominal voltage.
Frequency fold back and thermal shutdown protects the device during an over-current condition.
The TPS54319 is supported in the SwitcherPro™ Software Tool at www.ti.com/switcherpro.
For more SWIFT™ documentation, see the TI website at www.ti.com/swift.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 2.95 V to 6 V Input, 3-A Output, 2MHz, Synchronous Step Down Switcher With Integ 数据表 | 2010年 1月 28日 | |||
白皮书 | Understanding the trade-offs and technologies to increase power density........N (Rev. C) | PDF | HTML | 2023年 4月 27日 | |||
白皮书 | 了解提高功率密度的利弊权衡和所需 技术 (Rev. C) | PDF | HTML | 英语版 (Rev.C) | PDF | HTML | 2023年 4月 27日 | |
白皮书 | Understanding the trade-offs and technologies to increase power density........K (Rev. C) | PDF | HTML | 2023年 4月 26日 | |||
白皮书 | Understanding the trade-offs and technologies to increase power density........G (Rev. C) | PDF | HTML | 2023年 4月 14日 | |||
技术文章 | Smaller size now possible in 3A point-of-load converters | PDF | HTML | 2015年 6月 3日 | |||
应用手册 | Designing Type III Compensation for Current Mode Step-Down Converters (Rev. A) | 2010年 9月 15日 | ||||
EVM 用户指南 | TPS54319EVM-626 3-A, SWIFT Regulator Evaluation Module | 2010年 5月 19日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
WQFN (RTE) | 16 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点